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Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry
Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry
Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry
Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry
Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry
Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry
Specifications
Brand Name :
PRECISION
Model Number :
THC-800
Certification :
ISO
Place of Origin :
CHINA
MOQ :
1
Price :
$6000
Payment Terms :
T/T
Supply Ability :
100/month
Delivery Time :
15 working days
Packaging Details :
Standard export packaging
Customized support :
OEM ODM
Origin :
China
Material :
Stainless Steel
Controller :
Programmable LCD Touch Screen
Temp accuracy: :
0.5°C
Temp uniformity :
0.5°C
Refrigerant :
Environmental friendly R23/R404
Description

Custom Benchtop Thermal Cycling Chamber for the Electronics and Semiconductors Industry

1. Introduction

In the electronics and semiconductors industry, the reliability and stability of products are of utmost importance. From the chips in smartphones to the complex server motherboards, every electronic component needs to operate stably under various environmental conditions. The custom benchtop thermal cycling chamber, as a professional device, provides the ability to simulate real - world temperature changes in this industry. It helps enterprises comprehensively evaluate the performance of electronics and semiconductor products in the R & D, production, and quality control processes, ensuring the competitiveness of products in the market.

2. Key Features

2.1 Precise Temperature Cycling Control

  • Wide Temperature Range: The test chamber can achieve temperature changes from - 55°C to 150°C, capable of simulating various situations from extremely cold low - temperature environments to high - temperature operating states. In low - temperature environments, it can test the performance of electronic components in cold regions or under extreme working conditions, such as the reliability of satellite electronic equipment in the low - temperature environment of space. In high - temperature environments, it can simulate the heat accumulation generated when electronic devices operate under long - term high - load conditions, such as the heat - resistance performance of a server CPU during continuous operation.
  • High - Precision Temperature Control: The temperature control accuracy can reach ±0.1°C, ensuring the accuracy and stability of temperature changes during the thermal cycling process. This is particularly important for semiconductor devices, as even minor temperature fluctuations can affect their electrical performance, such as the switching speed of transistors and the signal transmission quality of integrated circuits.
  • Flexible Cycling Programs: Users can customize thermal cycling programs according to different test requirements. The heating and cooling rates can be adjusted between 1C/min and 5°C/min, and different temperature holding times can be set to simulate the temperature change patterns of electronic devices in actual use. For example, it can simulate the rapid temperature changes during the startup and shutdown of electronic products, as well as the stable high - temperature state during long - term operation.

2.2 Compact Benchtop Design

  • Space - Saving: Specifically designed for the limited space in laboratories and production lines, the test chamber is small in size and has a small footprint. It can be easily placed on a laboratory bench without taking up too much space. This enables enterprises to conduct efficient thermal cycling tests in a limited working area, improving space utilization.
  • Convenient Operation: The operation interface is simple and intuitive, equipped with easy - to - operate control buttons and a display screen. Operators can quickly set test parameters and monitor the temperature changes in real - time during the test process. Even first - time users can quickly get started, reducing training costs and operational errors.

2.3 Customized Sample Fixation and Testing Functions

  • Diverse Sample Fixtures: According to the different shapes and sizes of electronics and semiconductor products, various sample fixtures can be customized. For small chips, precision chip fixtures can be used to ensure that the chips are in full contact with the temperature environment during the test, accurately simulating their actual working state. For large - scale circuit boards, special circuit board fixing frames can be designed to facilitate the thermal cycling test of each component on the circuit board.
  • Multi - Parameter Testing Functions: In addition to thermal cycling tests, some test chambers can also integrate other testing functions, such as humidity testing and vibration testing. Through multi - parameter testing, the performance of electronics and semiconductor products in complex environments can be more comprehensively evaluated. For example, it can simulate the reliability of electronic products when they are affected by temperature changes and vibrations in a humid environment.

3. Technical Parameters

Parameter Items Details
Temperature Range - 55°C to 150°C
Temperature Accuracy ±0.1°C
Heating Rate Adjustable between 1°C/min and 5°C/min
Cooling Rate Adjustable between 1°C/min and 5°C/min
Internal Dimensions Customized range: Length 400mm to 2000mm, Width 400mm to 2000mm, Height 500mm to 2000mm
Humidity Range (Optional) 20%RH to 95%RH (if equipped with humidity testing function)
Humidity Accuracy (Optional) ±3%RH (if equipped with humidity testing function)
Vibration Frequency Range (Optional) 1Hz to 2000Hz (if equipped with vibration testing function)
Power Requirements 380V, 50/60Hz

4. Benefits for the Electronics and Semiconductors Industry

4.1 Improve Product Quality and Reliability

  • Early Problem Detection: In the product R & D stage, by simulating various temperature conditions with the thermal cycling test chamber, potential problems in electronics and semiconductor products can be detected in advance, such as solder joint cracking and thermal expansion mismatch between the chip and the substrate. Solving these problems in a timely manner can prevent product failures during actual use and improve the reliability and stability of products.
  • Optimize Product Design: Based on the test results, engineers can optimize the product's heat - dissipation design, material selection, etc. For example, if it is found through testing that a certain electronic device has poor heat - dissipation performance at high temperatures, the heat - dissipation structure can be improved or more efficient heat - dissipation materials can be selected to enhance the product's high - temperature resistance and extend its service life.

4.2 Reduce Costs and Risks

  • Reduce After - sales Maintenance Costs: Products that have undergone strict thermal cycling tests have a lower probability of failure in the market, thus reducing the costs of after - sales maintenance and replacement. This not only saves the capital investment of enterprises but also improves customer satisfaction and maintains the brand image of enterprises.
  • Shorten the R & D Cycle: Rapid thermal cycling tests can accelerate the product R & D process. Enterprises can quickly adjust the product design and process according to the test results, shortening the time from product R & D to market launch, seizing market opportunities, and improving the market competitiveness of enterprises.

4.3 Meet Industry Standards and Customer Requirements

  • Comply with Industry Standards: The electronics and semiconductors industry has strict quality standards and specifications. The custom benchtop thermal cycling chamber can help enterprises conduct tests that meet these standards, ensuring that products meet industry requirements and can pass various certifications smoothly, such as ISO, IEC, and other standard certifications.
  • Meet Customer Needs: As consumers' requirements for the performance and reliability of electronic products continue to increase, enterprises can better meet customer needs by using the thermal cycling test chamber to optimize product performance, win customer trust, and expand market share.

5. Application Scenarios

5.1 Chip R & D and Testing

  • Chip Reliability Evaluation: During the chip R & D process, thermal cycling tests are used to evaluate the stability of the chip's electrical performance under different temperature conditions, and to detect the reliability of the internal circuits of the chip, ensuring that the chip can operate normally in various environments.
  • Chip Packaging Testing: Conduct thermal cycling tests on chip packaging to check the thermal compatibility between the packaging materials and the chip, and prevent problems such as packaging cracking and pin breakage caused by thermal expansion differences, improving the quality and reliability of chip packaging.

5.2 Circuit Board Manufacturing and Detection

  • Circuit Board Welding Quality Detection: During the circuit board manufacturing process, thermal cycling tests are used to detect the reliability of solder joints and discover potential welding defects, such as virtual soldering and cold soldering, ensuring the stability of electrical connections on the circuit board during use.
  • Circuit Board Performance Optimization: Conduct thermal cycling tests on various electronic components on the circuit board, evaluate the performance of the components at different temperatures, and optimize the layout and heat - dissipation design of the circuit board to improve the overall performance of the circuit board.

5.3 Whole - Machine Testing of Electronic Products

  • Product Environmental Adaptability Testing: Conduct whole - machine thermal cycling tests on electronic products such as mobile phones, computers, and smart wearable devices, simulate the use of products in different environmental temperatures, and detect the stability and reliability of products, ensuring that products can operate normally in various climate conditions.
  • Product Life Prediction: Through accelerated thermal cycling tests, predict the service life of electronic products, provide a basis for enterprises to formulate reasonable product quality - assurance policies, and also help enterprises improve product design and enhance product durability.

Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors IndustryCustom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry

6. Conclusion

The custom benchtop thermal cycling chamber plays an indispensable role in the electronics and semiconductors industry. Its precise temperature cycling control, compact design, and customized functions provide enterprises with an efficient and reliable testing solution. By using this test chamber, enterprises can improve product quality, reduce costs, meet industry standards and customer requirements, and gain an advantage in the fierce market competition. If your enterprise needs such a professional testing device in the R & D, production, and quality control processes of electronics and semiconductor products, please feel free to contact us at any time to learn more about the custom benchtop thermal cycling chamber. Let's work together to contribute to the development of the electronics and semiconductors industry.
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Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry

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Product Detail
Brand Name :
PRECISION
Model Number :
THC-800
Certification :
ISO
Place of Origin :
CHINA
MOQ :
1
Price :
$6000
Contact Supplier
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Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry
Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry
Custom Benchtop Thermal Cycling Chamber For Electronics And Semiconductors Industry

Dongguan Precision Test Equipment Co., Ltd.

Verified Supplier
1 Years
guangzhou
Since 2006
Business Type :
Manufacturer, Exporter, Trading Company, Seller
Main Products :
Environmental Test Chambers, Climatic Test Chamber, Thermal Shock Test Chamber
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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