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Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw
Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw
Specifications
Brand Name :
GaNova
Place of Origin :
Suzhou China
MOQ :
1
Delivery Time :
8-10week days
Product Name :
DAD3350 Automatic Dicing Saw
Max. workpiece size :
Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)
Application :
1.8 kW, 2.2 kW
Machine dimensions(W×D×H)mm :
900 × 1,050 × 1,800
Performance :
stable
Machine weight :
Approx. 1,200kg
X-axis Cutting range :
260mm
X-axis Cutting speed :
0.1 ～ 600mm/s
Description

DAD3350 Wafer Dicing Machine Automatic Dicing Saw X-Axis Cutting Range 260mm

Supports a wide range of applications

DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. Support for blades of up to Φ5 inches is possible with user-specified specifications. In addition, the alignment function for multiple-mounted workpieces can also be added as an option.

Improved throughput

The DAD3350 achieves improvement in throughput by increasing the speed of each axis.

Ease of use

Operability is improved with installation of an LCD touch screen and Graphical User Interface (GUI). Easy operation is achieved with a visual display showing processing conditions and various statuses with icon buttons. In addition, operation commonalities were considered in order to achieve easy replacement from the 300/500 series (existing models).

Process quality

By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage and vibration, a more stable processing point can be achieved.

Process controls

Auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed to improve equipment productivity. In addition, the microscope includes an air blow mechanism and a lens shutter to prevent contamination. As an option, a low magnification microscope can be added for rough alignment. Through condition monitoring the processing conditions and various other statuses can be known at any given time. Advanced process control features can be added as options, including an on-screen cutting water management system for cutting water flow control.

Specifications

Specification

Unit

1.8 kW

2.2 kW

Max. workpiece size

-

Φ8 inch (250 mm × 250 mm, Φ300 mm user-specified specification)

X-axis

Cutting range

mm

260

Cutting speed

mm/s

0.1 ～ 600

Y-axis

Cutting range

mm

260

Index step

mm

0.0001

Index positioning accuracy

mm

0.002/260
(Single error) 0.002/5

Z-axis

Max. stroke

mm

32.2

31.4

Moving resolution

mm

0.00005

Repeatability accuracy

mm

0.001

θ-axis

Max. rotating angle

deg

380

Spindle

Rated torque

N・m

0.29

0.70

Revolution speed range

min‐1

6,000 ～ 60,000

3,000 ～ 30,000

Machine dimensions(W×D×H)

mm

900 × 1,050 × 1,800

Machine weight

kg

Approx. 1,200

* Product appearance, features, specifications, and other details may change due to technical modifications.
* Please read the standard specification sheet thoroughly before use.

Product tags

mdf design cutting machine

,

v groove cutting machine

,

machining hdpe
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Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw

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Product Detail
Brand Name :
GaNova
Place of Origin :
Suzhou China
MOQ :
1
Delivery Time :
8-10week days
Product Name :
DAD3350 Automatic Dicing Saw
Max. workpiece size :
Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)
Contact Supplier
Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw

Shanghai GaNova Electronic Information Co., Ltd.

Verified Supplier
3 Years
shanghai, shanghai
Since 2020
Business Type :
Manufacturer
Main Products :
GaN Epitaxial Wafer, SiC Epitaxial Wafer, GaAs Epi Wafer
Employee Number :
>100
Certification Level :
Verified Supplier
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