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Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
Specifications
Brand Name :
Aorun
Model Number :
Aorun 1311
Place of Origin :
China
MOQ :
450KG
Price :
Negotiable
Payment Terms :
L/C, D/A, D/P, T/T,, MoneyGram, Western Union
Supply Ability :
100000kg per month
Delivery Time :
5-8 work days
Packaging Details :
drums
Product name :
Epoxy AB Resin
Mixing Ratio :
2:1
Application :
Pouring
Type :
Liquid Chemical
Advantage :
Bubble Free and Self Leveling
Usage :
Epoxy floor coatings
Description

Epoxy Resin AB Glue Epoxy Potting Compound For Electronic Components Encapsulation



Quick Detail:

Name

Epoxy Resin 1311

 Usage

Epoxy floor coatings

Mixing Ratio

 A: B =2:1 (By weight) Applications

Epoxy floor coatings,Electronic component potting epoxy compound


Description:

silicones systems. Our products feature outstanding electrical insulation properties, superior adhesive strength, thermal conductivity and excellent chemical resistance. Potting and encapsulating compounds provide reliable long term performance for microelectronic, electronic, electrical devices.

Features:


1. No bubbles, good flatness, good gloss, high hardness
2. Cured products with good flame retardant property
3. Good acid-base resistance
4. Good moisture, water, oil, dust resistance
5. Good resistance of humidity and weather aging
6. Good heat dissipation performance

Specification:
Items Units/conditions
Technical Data
Viscosity Shore-D 80-85
Volume resistivity 25℃/ Ω./ cm 4.3x1015
Surface resistivity 25℃/ Ω. 2.6x1014
Dielectric strength 25℃ KV/MM 25
Coefficient of linear expansion CM/K <6.1x10-5
Glass transition temperature ℃ >90
Temperature resistant ℃ -60~120

The above performance data is typical data measured in a laboratory environment
with a temperature of 25°C and a humidity of 70%. It is for customer reference only



Pouring Epoxy AB Potting Glue Electronic Components Encapsulation

FAQ:

Q1: Are you trading company or manufacturer ?

A: We are factory.

Q2: How long is your delivery time?

A: It is 5-10 days if the goods are in stock. or it is 15-20 days if the goods are not instock, it is according to quantity.
Q3: What is your terms of payment ?

A: T/T,L/C.
Q4: Can I get a sample ?

A: If our present samples are ok for you. Samples are free,only need to to pay for the freight. If you want to see a sample with your logo,some sample fees will be needed.
Q5: Does you accept OEM or Customized production?

A: Yes, We are capable in developing products according to your requirements.


Packaging:
We offer different size of packaging, 5kg buckets and 20kg buckets are normal size. Customized
Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
Company Display:
Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
Product tags

epoxy encapsulation

,

encapsulation epoxy

,

plastic filler compound
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Pouring Epoxy AB Potting Glue Electronic Components Encapsulation

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Product Detail
Brand Name :
Aorun
Model Number :
Aorun 1311
Place of Origin :
China
MOQ :
450KG
Price :
Negotiable
Payment Terms :
L/C, D/A, D/P, T/T,, MoneyGram, Western Union
Contact Supplier
Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
Pouring Epoxy AB Potting Glue Electronic Components Encapsulation
Pouring Epoxy AB Potting Glue Electronic Components Encapsulation

Chongqing Aorun Industrial Co., Ltd.

Active Member
4 Years
chongqing, chongqing
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Seller
Main Products :
Car Brake Pads, Electronic Control Unit, Car Spark Plug
Total Annual :
5000000-10000000
Employee Number :
100~150
Certification Level :
Active Member
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