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0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame
0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame
0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame
0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame
0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame
0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame
Specifications
Brand Name :
OHMALLOY
Model Number :
C19400
Certification :
SGS
Place of Origin :
China
MOQ :
20kg
Price :
30USD/KG
Supply Ability :
50T/Monthes
Packaging Details :
woodencase
Type :
Strip
Thickness :
0.2
Application :
Industry
Material :
Copper / Copper Alloy
Shape :
wire
Resistance (μω.m) :
Stable
Welding current :
International Standard
Description

0.2mm thick C19400 foil for semiconductor chip lead frame

The remarkable characteristics of the material are: high strength, high conductivity, high precision and high softening temperature resistance, as well as suitable processing properties and electroplating brazing properties.

It is mainly used for the production of semiconductor chip lead frame, integrated circuit and electronic discrete devices, electronic industry connectors, etc.

Standard:

GB/T DIN EN ASTM JIS
QFe2.5

CuFe2P

2.1310

CuFe2P

CW107C

 C19400 C19400

Chemical composition:

Cu Bal.
Fe 2.1-2.6
Zn 0.05-0.2
P 0.015-0.15


Physical property:

Density(g/cm3) 8.9
Conductivity IACS% {(20℃)} 60min
Modulus of elasticity(KN/mm2) 121
Thermal conductivity {W/(m*K)} 280

Coefficient of thermal expansion

(10-6/℃ 20/℃ ~100/℃)

 17.7

Status Tensile strength Yield strength Elongation A50 Hardness Bending test
90°(R/T)
(Rm,MPa) (Rp0.2,MPa) (%) (HV) GW BW
R300 300-340 240max 20min 80-100 0 0
R340 340-390 240min 10min 100-120 0 0
R370 370-430 330min 6min 120-140 0 0
R420 420-480 380min 3min 130-150 0.5 0.5
R470 470-530 440min 4min 140-160 0.5 0.5
R530 530-570 470min 5min 150-170 1

1



Package

Product tags

aluminium led pcb plate

,

black aluminum diamond plate sheet

,

black diamond plate aluminum sheet
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0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame

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Product Detail
Brand Name :
OHMALLOY
Model Number :
C19400
Certification :
SGS
Place of Origin :
China
MOQ :
20kg
Price :
30USD/KG
Contact Supplier
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0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame
0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame
0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame

Ohmalloy Material Co.,Ltd

Verified Supplier
10 Years
shanghai, shanghai
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company
Main Products :
FeCrAl Alloy, Nickel Strip, Bimetallic Strip
Total Annual :
4000000-6000000
Employee Number :
20~50
Certification Level :
Verified Supplier
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