355nm plastic/ ceramic / metal / ABS UV Laser Marking machine
Product Introduction:
1) Huahai UV series laser marking machine adopt imported high-quality USA optowave laser source( which is feed backed most stable on market)high efficient photoelectric conversion , output wavelength is 355nm, widely used in high-end ultra-fine laser processing market;
2) 355nm UV laser beam spot is extremely small, the material can be reduced to a large extent the mechanical deformation and processing small heat-affected; so it is mainly used on ultra-fine marking, engraving particularly suitable for food, pharmaceutical packaging material marking and coding porous, high-speed division of the glass material and silicon wafers cut complex graphics applications.
3) UV laser marker also belongs to laser marking series, while it is the newest laser processing technology; due to the traditional laser marking machine (Fiber and Co2)uses a laser thermal processing technology, in terms of fineness obtained improvement restrictive development, however, UV laser marking machine is a cold processing technology, is a big leap in laser technology.
Products Advantages:
Specifications:
Model | HM03P/HM05P/HM07P |
Wavelength | 355nm |
Laser output power | ≥3W |
Pulse width | ≤18ns |
frequency of laser | 0-100kHz |
Standard engraving range | 110mm×110mm |
Repeating precision | ±0.005mm |
Minimal linear Width | ≤0.01mm |
Marking speed | 7000mm/s |
Electrical Power | 220V |
Cooling system | Air cooling |
UV Laser source | 3W China RFH laser or |
Galvo | Top brand made in China |
Control card and software | EZCAD laser mark |
Lens | Imported one |
Applied material | Plastic , glass , metal |
Application Industries:
Mainly based on its unique low-power laser beam. It is especially suitable for the high-end market of ultra-fine processing. The surfaces of bottles for cosmetics, pharmaceuticals, food and other high-molecular materials are marked with fine effects and clear and firm markings. Better than ink coding and no pollution; flexible pcb board marking, dicing; silicon wafer micro hole, blind hole processing; LCD liquid crystal glass two-dimensional code marking, glass surface punching, metal surface coating marking, Plastic buttons, electronic components, gifts, communications equipment, building materials, and so on.
Electronic components, integrated chips, electrical appliances, communication equipment, tools, precision machinery, frames, watches and clocks, auto parts, crystal glass marking, plastic cases ETC.
Samples: