Green Laser Marking Machine For PCB , Glass Marking , Inner Glass , Semiconductor , Photovoltaic , Wafer Scribe
Advantage:
"Cold" marking: very careful, the ideal solution for marking soft materials and sensitive components.
Micro marking: Small 2D Data Matrix codes, very detailed logos, precise removal of thin layers of coating and its ultra-thin beam generates exceptional marking quality.
Unique: marks materials that are not reacting or reacting poorly to other infrared wavelengths: from raw plastics to the most translucid, reflective metals (copper, silver, gold) and ceramic etc.
Total connectivity: all the communication tools are natively available to communicate with your environment.
Parameters:
Laser Wavelength | 532nm | 532nm | 532nm |
Laser Power | 3W | 5W | 8W |
Marking Field | 100mmx100mm | 100mmx100mm | 50x50/100x100mm |
Marking Speed | 14000mm/s | 14000mm/s | 14000mm/s |
Beam Quality | M2<1.2 | M2<1.2 | M2<1.2 |
Repetition Frequency | 15-100KHz | 15-100KHz | 15-100KHz |
Minimum Line Width | 10um | 10um | 10um |
Minimum Character | 0.05mm | 0.05mm | 0.05mm |
Repetition Precision | ±0.002mm | ±0.002mm | ±0.002mm |
Machine Power | 600W | 800W | 1000W |
Samples: