DOUBLE DATA RATE (DDR) SDRAM

FEATURES

• 167 MHz Clock, 333 Mb/s/p data rate

• VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V

• Bidirectional data strobe (DQS) transmitted/ received with data, i.e., source-synchronous data capture (x16 has two - one per byte)

• Internal, pipelined double-data-rate (DDR) architecture; two data accesses per clock cycle

• Differential clock inputs (CK and CK#)

• Commands entered on each positive CK edge

• DQS edge-aligned with data for READs; centeraligned with data for WRITEs

• DLL to align DQ and DQS transitions with CK

• Four internal banks for concurrent operation

• Data mask (DM) for masking write data (x16 has two - one per byte)

• Programmable burst leCM GROUPhs: 2, 4, or 8

• Concurrent Auto Precharge option supported

• Auto Refresh and Self Refresh Modes

• FBGA package available

• 2.5V I/O (SSTL_2 compatible)

• t RAS lockout (t RAP = t RCD)

• Backwards compatible with DDR200 and DDR266

OPTIONS PART NUMBER

• Configuration

32 Meg x 4 (8 Meg x 4 x 4 banks) 32M4

16 Meg x 8 (4 Meg x 8 x 4 banks) 16M8

8 Meg x 16 (2 Meg x 16 x 4 banks) 8M16

• Plastic Package

66-Pin TSOP (OCPL) TG

60-Ball FBGA (16x9mm) FJ

• Timing - Cycle Time

6ns @ CL = 2.5 (DDR333B–FBGA)¹ -6

6ns @ CL = 2.5 (DDR333B–TSOP)¹ -6T

7.5ns @ CL = 2 (DDR266A)² -75Z

• Self Refresh

Standard none

NOTE: 1. Supports PC2700 modules with 2.5-3-3 timing

2. Supports PC2100 modules with 2-3-3 timing

DDR333 COMPATIBILITY

DDR333 meets or surpasses all DDR266 timing requirements thus assuring full backwards compatibility with current DDR designs. In addition, these devices support concurrent auto-precharge and t RAS lockout for improved timing performance. The 128Mb, DDR333 device will support an (t REFI) average periodic refresh interval of 15.6µs.

The standard 66-pin TSOP package is offered for point-to-point applications where the FBGA package is intended for the multi-drop systems.

The Micron 128Mb data sheet provides full specifications and functionality unless specified herein.

FBGA 60-BALL PACKAGE DIMENSION

FBGA PACKAGE MARKING

Due to the physical size of the FBGA package, the full ordering part number is not printed on the package. Instead the following package code is utilized.

Top mark contains five fields 12345

• Field 1 (Product Family)

DRAM D

DRAM - ES Z

• Field 2 (Product Type)

2.5 Volt, DDR SDRAM, 60-ball L

• Field 3 (Width)

x4 devices B

x8 devices C

x16 devices D

• Field 4 (Density / Size)

128Mb F

• Filed 5 (Speed Grade)

-6 J

-75Z P

-75 F

-8 C

66-PIN TSOP PACKAGE DIMENSION 66-PIN TSOP PACKAGE PIN ASSIGMENT