30W UV Flying Laser Marking Machine For Medical Containers and Nonmetal Materials

Parameter:

1. Machine model number: LD-FEM-UV3030

2. Laser Power: 30W

3. Laser wavelength 355nm

4. Laser beam Quality: M2:＜1.5

5. Laser Repeat Frequency: ≤100kHz

6. Standard Marking Range: 100x100mm ( Static status)

7. Marking Speed 0-40m/minute on line height 3mm 8-30 characters.

8. Min. Characters 1.5mm

9. Repeatability: ±0.001mm

10. Cooling System: Air cooler + Water cooler

11. Power Supply AC220V/Single phase/50Hz/10A 1KW

Description

Online flying laser marking machine adopts the combination of automatic feeding system and rapid laser marking equipment, Adoption of fiber laser system for outputting laser, and then achieve marking functions by high-speed scanning galvanometer mirror system.The electro-optical conversion efficiency of fiber laser marking can reach to 90% or above, it has higher beam quality in comparison to semiconductor laser marking machine. Online marking has high production efficiency, stable quality, and online marking system is suitable for multitudinous sequence production.The machine is designed for long-time maintenance-free.

Online flying laser marking machine is a special type of laser marking equipment applied to the production line. According to customer's different needs matching fiber, semiconductor, CO2, YAG and other models and automatic assembly line work bench to meet customer requirements of flight standards system, to achieve assembly line operations to improve production efficiency. Compared with the traditional ink printing, has the advantages of high efficiency, convenient without supplies, non-toxic, no pollution etc.

Applied materials:

Brittleness material like fire-proof material, glass, ceramics, monocrystalline silicon and polycrystalline silicon etc. Special material like small Flexible Printed Circuit etc

Applied Industries: It can be applied for precision marking, micro-processing and cold processing in micro-electronics industry. Marking, scribing, carving, cutting and surface processing on various type of chips, flexible printed circuit board, ultra-thin glass, LCD screen, textile, sheet ceramic, semiconductor wafer, IC grain, sapphire, polymeric film, brittleness material and Special plastic packaging etc.