15W Desk Style Plastics and Non-metal Material Applied UV Laser Marking Machine
Parameter:
Laser Medium | ND:YVO4 |
Laser Wavelength | 355nm |
Average Output Power | ≥15W@30KHZ |
Peak Power: | ≥10KW |
Marking Range (mm) | 100×100(can be enlarged at 160×160, 250x250 or 300x300 optional) |
Marking Speed | 15000mm/S |
Maintenance | Free |
Repeat Accuracy | ±0.01mm |
Cooling System | Water cooler |
Main Machine Dimension(mm) | 530X430X710 |
Weight of Whole Machine | 60KG |
Power Supply | 220V±22V/single phase/ 50Hz /10A |
Overall Power Consumption | 200W |
Control System Dimension | Integration |
UV laser marking machine is dominated by its unique low-power laser beam, quiet suitable for high-end market of super-fine processing, like marking of bottles for cosmetics, pharmaceuticals, food and other polymer materials, good performance, clear and stable mark, better than ink marking and has no pollution; flexible pcb board marking, scribing; silicon wafer micro hole, blind hole processing; LCD liquid crystal glass two-dimensional code marking, glassware surface drilling, metal surface coating marking, plastic buttons marking, electronic component marking, gifts marking, communication equipment marking, construction materials marking and so on.
Application Industry: Automobile and electronics field, Food and drinking industry, Medical technology, Jewelry, Daily necessities
Application Materials:
Metals, Glass, Crystal, PCBs, plastics, fiber, paper, coatings, silicon wafer, LCD, polyamides, wires, plugs, etc.
Features:
1. Adopt high quality UV laser source, wave length is 355nm
2. Compare with normal laser marking machine, the focused spot of UV laser is smaller and marking result is better precision. It has incomparable advantage than other laser machines for applied precision marking, precision cutting and micro processing on the special materials.
3. It suitable for precision micro machining, cold processing. Compare with infrared diode pumpd machine, it has higher absorption rate of metal, monocrystalline silicon, polycrystalline silicon, industrial ceramics, glass etc, can used for marking, cutting, scribing and cutting for small Flexible Printed Circuit.