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Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval
Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval
Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval
Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval
Specifications
Brand Name :
Wenyi Electronics
Model Number :
GPI-Flex-C-010
Certification :
RoHs,SGS，ISO9001:2008
Place of Origin :
Made In China
MOQ :
500 pcs/ lot
Price :
Negotiable
Payment Terms :
T/T, L/C, D/A, D/P, Western Union, MoneyGram
Supply Ability :
20000 square meters/ month
Delivery Time :
12-15 working days afer sample approval
Packaging Details :
each in ploybag, then in carton box, or as per request.
Material :
1 OZ copper
layer :
1-8 layers
Print :
silkscreen
Finger :
sink gold or tin plated
Type :
LGF Backlight module
Application :
Mobile Smart Device backlight
Description

Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval

Item decription:

Mobile Smart Device Backlight LGF Module FPC Flexible Printed Circuit

Material: Polymide, LGF

Cover film: PI cover film

Type: LGF backlight module ( LED backlight )

Copper : 0.5 OZ

Finger Pitch: 1 mm gold finger

Stiffener: PI

Thickness: 0.27mm -0.36mm.

Business Terms:

MOQ : 500 pcs/ lot

Sample lead time: 8-12 working days

Mass production lead time: 10-14 working days , as per order Qty.

Payment By T/T or LC or others.

Our Advantage:

  1. Strong R&D capability
  2. Stable in quality
  3. Experienced in backligth LGF module
  4. Quick delivery
  5. Capable to make 1-8 layers FPC
  6. perfect quality control process.

Application:

  1. * Household appliances
  2. * Security systems, Bank POS machine payment service system.
  3. * High Precision PCB and High Density PCB
  4. * Various Mobile Smart Device use
  5. * Various Mobile device FPC and Circuit module

Technical specification:

FPC Manufacturing Capability Technical Performance Data
Finished FPC Size Min.:4x4mm Max.:250x1200mm
FPC Board Thickness: 0.08-0.12mm for single layer, 0.12-0.22mm for double layer
Stiffener Material Choice PI.PET,FR4-PI
Pitch of the Pin 0.3mm, 0.5mm,0.8mm,1.0mm, 1.25mm,2.54mm
Finished Board Thickness Tolerance ±0.03mm
Finished hole diameter(Min.) 0.15mm
Finished hole diameter(Max) 0.6mm
NPTH Hole diameter tolerance ±0.025mm
PTH hole diameter tolerance ±0.050mm
Copper foil thickness 18um,35um,70um/
Circuit width/spacing(Min.) ≥0.065mm(1/2oz)≥0.05mm(1/3oz)
Surface Finished type OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc
Gold Flash Ni/Au thickness Ni:2.54-9um Au:0.025-0.5um
Immersion Tin thickness 0.7-1.2um
Tin plating thickness 3-15um
Drill hole position tolerance ±0.05mm
Punching dimension tolerance ±0.05mm
Certificate ROHS,UL,ISO9001 SGS, etc

Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval

Product tags

flexible led module

,

led neon flex order

,

osram led module
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Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval

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Product Detail
Brand Name :
Wenyi Electronics
Model Number :
GPI-Flex-C-010
Certification :
RoHs,SGS，ISO9001:2008
Place of Origin :
Made In China
MOQ :
500 pcs/ lot
Price :
Negotiable
Contact Supplier
Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval
Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval

WenYI Electronics Electronics Co.,Ltd

Active Member
7 Years
guangdong, shenzhen
Since 2006
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
FPC Membrane Switch, Capacitive Membrane Switch, Embossing Membrane Switch
Total Annual :
1,500,000-2,500,000
Employee Number :
60~110
Certification Level :
Active Member
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