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Supply Ability :
36pcs
Delivery Time :
3-5 Day
Packaging Details :
International Standard Packaging
Category :
IC FPGA
Condition :
Original 100%,Brand New and Original,New
Series :
Stratix III Enhanced
Number of Logic Array Blocks - LABs :
1900
Number of I/Os :
488 I/O
Package / Case :
FBGA-780
Operating Supply Voltage :
1.2 V to 3.3 V
Embedded Block RAM - EBR :
297 kbit
Service :
BOM Kitting
Lead time :
In Stock,contact us
Description
EP3SE50F780I3N Field Programmable Gate Array Stratix III Enhanced
Product Attribute
Attribute Value
Intel
FPGA - Field Programmable Gate Array
Stratix III Enhanced
47500
1900
488 I/O
1.2 V to 3.3 V
- 40 C
+ 85 C
SMD/SMT
FBGA-780
Tray
Series:
Stratix III
Brand:
Intel / Altera
Embedded Block RAM - EBR:
297 kbit
Moisture Sensitive:
Yes
Product Type:
FPGA - Field Programmable Gate Array
Factory Pack Quantity:
36
Subcategory:
Programmable Logic ICs
Total Memory:
5625 kbit
Tradename:
Stratix
Part # Aliases:
967246
Stratix III devices offer the following features:
■ Up to 1,104 user I/O pins arranged in 24 modular I/O banks that support a wide range of industry I/O standards ■ Dynamic On-Chip Termination (OCT) with auto calibration support on all I/O banks ■ High-speed differential I/O support with serializer/deserializer (SERDES) and dynamic phase alignment (DPA) circuitry for 1.6 Gbps performance ■ Support for high-speed networking and communications bus standards including SPI-4.2, SFI-4, SGMII, Utopia IV, 10 Gigabit Ethernet XSBI, Rapid I/O, and NPSI ■ The only high-density, high-performance FPGA with support for 256-bit AES volatile and non-volatile security key to protect designs ■ Robust on-chip hot socketing and power sequencing support ■ Integrated cyclical redundancy check (CRC) for configuration memory error detection with critical error determination for high availability systems support ■ Up to 16 global clocks, 88 regional clocks, and 116 peripheral clocks per device ■ Up to 12 phase-locked loops (PLLs) per device that support PLL reconfiguration, clock switchover, programmable bandwidth, clock synthesis, and dynamic phase shifting ■ Memory interface support with dedicated DQS logic on all I/O banks ■ Support for high-speed external memory interfaces including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular I/O banks