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Supply Ability :
102 pcs
Delivery Time :
3-5 Day
Packaging Details :
International Standard Packaging
Category :
Programmable Logic ICs
Condition :
Original 100%,Brand New and Original,New
Number of I/Os :
640 I/O
Product :
Virtex-5
Package / Case :
FBGA-1136
Distributed RAM :
1640 kbit
Embedded Block RAM - EBR :
7632 kbit
Maximum Operating Frequency :
550 MHz
Service :
BOM Kitting
Lead time :
In Stock,contact us
Description
XC5VLX155T-2FFG1136I IC FPGA FBGA-1136 Field Programmable Gate Array
Product Attribute
Attribute Value
Xilinx
FPGA - Field Programmable Gate Array
Virtex-5
640 I/O
1 V
- 40 C
+ 100 C
SMD/SMT
FBGA-1136
Data Rate:
6.5 Gb/s
Series:
XC5VLX155T
Brand:
Xilinx
Distributed RAM:
1640 kbit
Embedded Block RAM - EBR:
7632 kbit
Maximum Operating Frequency:
550 MHz
Moisture Sensitive:
Yes
Number of Transceivers:
16 Transceiver
Product Type:
FPGA - Field Programmable Gate Array
Factory Pack Quantity:
1
Subcategory:
Programmable Logic ICs
Tradename:
Virtex
Summary of Virtex-5 FPGA Features
• Flexible configuration options − SPI and Parallel FLASH interface − Multi-bitstream support with dedicated fallback reconfiguration logic − Auto bus width detection capability
• System Monitoring capability on all devices − On-chip/Off-chip thermal monitoring − On-chip/Off-chip power supply monitoring − JTAG access to all monitored quantities
• Integrated Endpoint blocks for PCI Express Designs − LXT, SXT, TXT, and FXT Platforms − Compliant with the PCI Express Base Specification 1.1 − x1, x4, or x8 lane support per block − Works in conjunction with RocketIO™ transceivers
• Tri-mode 10/100/1000 Mb/s Ethernet MACs − LXT, SXT, TXT, and FXT Platforms − RocketIO transceivers can be used as PHY or connect to external PHY using many soft MII (Media Independent Interface) options
• RocketIO GTP transceivers 100 Mb/s to 3.75 Gb/s − LXT and SXT Platforms
• RocketIO GTX transceivers 150 Mb/s to 6.5 Gb/s − TXT and FXT Platforms
• PowerPC 440 Microprocessors − FXT Platform only − RISC architecture − 7-stage pipeline − 32-Kbyte instruction and data caches included − Optimized processor interface structure (crossbar)
• 65-nm copper CMOS process technology • 1.0V core voltage • High signal-integrity flip-chip packaging available in standard or Pb-free package options