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XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip
XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip
Specifications
Brand Name :
Xilinx Inc.
Model Number :
XCVU125-1FLVB1760I
Certification :
Lead free / RoHS Compliant
MOQ :
1 pcs
Price :
USD 20000~26000 pcs
Payment Terms :
T/T, Western Union, Paypal, Trade Assurance, Credit Card
Supply Ability :
65 pcs
Delivery Time :
3-5 Day
Packaging Details :
International Standard Packaging
Category :
Programmable Logic ICs
Condition :
Original 100%,Brand New and Original,New
Number of I/Os :
750 I/O
Product :
Virtex UltraScale
Package / Case :
FBGA-2104
Distributed RAM :
9.7 Mbit
Embedded Block RAM - EBR :
88.6 Mbit
Data Rate :
30.5 Gb/s
Service :
BOM Kitting
Lead time :
In Stock,contact us
Description

XCVU125-1FLVB1760I Xilinx FPGA Chip FBGA-1760 Virtex UltraScale

Product Attribute Attribute Value
Xilinx
FPGA - Field Programmable Gate Array
Virtex UltraScale
1566600
750 I/O
0.85 V
- 40 C
+ 100 C
SMD/SMT
FBGA-1760
Data Rate: 30.5 Gb/s
Series: XCVU125
Brand: Xilinx
Distributed RAM: 9.7 Mbit
Embedded Block RAM - EBR: 88.6 Mbit
Moisture Sensitive: Yes
Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 1
Subcategory: Programmable Logic ICs
Tradename: Virtex UltraScale

Summary

Virtex® UltraScale FPGAs: High-capacity, high-performance FPGAs enabled using both monolithic and next-generation SSI
technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance to address key market and
application requirements through integration of various system-level functions.
Virtex UltraScale+ HBM devices incorporate 4GB or 8GB HBM stacks adjacent to the FPGA die. Using
stacked silicon interconnect technology, the FPGA communicates to the HBM stacks through memory
controllers that connect to dedicated low-inductance interconnect in the silicon interposer. Each Virtex
UltraScale+ HBM FPGA contains one or two HBM stacks, resulting in up to 16GB of HBM per FPGA.
The FPGA has 32 HBM AXI interfaces used to communicate with the HBM. Through a built-in switch
mechanism, any of the 32 HBM AXI interfaces can access any memory address on either one or both of the
HBM stacks due to the flexible addressing feature. This flexible connection between the FPGA and the
HBM stacks results in easy floorplanning and timing closure. The memory controllers perform read and
write reordering to improve bus efficiency. Data integrity is ensured through error checking and correction
(ECC) circuitry.

XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip

Product tags

PC28F512P33TFA

,

PC28F00AP30BFA

,

chip dmd 10766038b
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XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip

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Product Detail
Brand Name :
Xilinx Inc.
Model Number :
XCVU125-1FLVB1760I
Certification :
Lead free / RoHS Compliant
MOQ :
1 pcs
Price :
USD 20000~26000 pcs
Payment Terms :
T/T, Western Union, Paypal, Trade Assurance, Credit Card
Contact Supplier
XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip

CHUANGXINDA ELECTRONICS-TECH CO., LIMITED

Active Member
5 Years
guangdong, shenzhen
Since 2000
Business Type :
Distributor/Wholesaler, Agent, Importer, Exporter, Trading Company
Main Products :
IC FPGA, Xilinx FPGA Chip, ALTERA FPGA Chip
Total Annual :
30,000,000-45,000,000
Employee Number :
50~100
Certification Level :
Active Member
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