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High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes
High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes
Specifications
Brand Name :
OEM
Model Number :
Customized
Certification :
ISO9001/ISO14001
Place of Origin :
Guangdong China
MOQ :
5pcs
Price :
negotiable
Payment Terms :
T/T
Supply Ability :
10000pcs per month
Delivery Time :
10-14 wds
Packaging Details :
25 sets in Vacuum bag/ Carton
Material :
High TG FR4
Layers :
2-48 layers
Max size :
610X915mm
Min Via :
0.1mm
Surface treatment :
ENIG
Color :
Matt Green
Board thickness :
0.15-4.5mm
Outer layer copper thickness :
1/3-12OZ
Description

High TG170 FR4 Multilayer HDI PCB with Buried and Blind Via Holes

1. Product Descprition

Item Specification
Material High TG FR4
Layers 4-20 layers
HDI HDI plus 1 or 2
Copper thickness 1/3-12OZ
Minimum Via 0.1mm
Surface treatment ENIG,OSP
Board thickness 0.15-4.5mm
Solder mask color Gree,Blue,Black,Red,White
Tolerance of board thickness T>=1.0mm, Tol: +/-10%
T<1.0mm, Tol:+/-0.1mm

2.HDI capablity and example

1) X+X process

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

( Layer Drawing) (Cross section)

2) 1-N-1 process

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

( Layer Drawing) (Cross section)

3)2-N-2 process-B

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

( Layer Drawing) (Cross section)

4)2-N-2 process-N(Advanced:6+N+6)

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

( Layer Drawing) (Cross section)

3. Application

1)Communication electronic equipment:Smartphone,Multifunctional Phone,visual telephone

2)Computer:Laptop, Super computer, Pad.

3) Consumer Electronics: Camera, Digital TV, Video

4) Car

5) Equipments

6) Space and aviation: satellite,guided missile

7) Medical Appliances

8) Industral Control

4.Package

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

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High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

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Product Detail
Brand Name :
OEM
Model Number :
Customized
Certification :
ISO9001/ISO14001
Place of Origin :
Guangdong China
MOQ :
5pcs
Price :
negotiable
Contact Supplier
High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

Shenzhen Fany Technology Co.,Ltd

Active Member
7 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer
Main Products :
FR4 Multilayer PCB, HDI PCB Board, Double Sided PCB
Total Annual :
2000000-3000000
Employee Number :
200~500
Certification Level :
Active Member
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