Aluminum PCB Clad can be advantageous to use for their ability to integrate a dielectric polymer layer with a high thermal conductivity for a lower thermal resistance.
Metal core PCBs transfer heat 8 to 9 times faster than FR4 PCBs. Al PCB laminates dissipate heat, keeping heat generating components cooler which results in increased performance and life.
Item | Technical Specification | |
Number of Layers | 2-60 layers | |
Laminate | CEM-3,FR4 (High Tg, Halogen Free),Rogers,Teflon, Arlon, Metal Base (Aluminum, Copper), Mixematerial Kapton, PI, PET for flex. | |
Laminate Brand | KB,Shengyi,Nanya,Isola,Goword,grace,Rogers,Arlon,Taconic,Ventec and customer specify | |
Maximum board size | 610X1 060mm | |
Board thickness | 0.15-4.5mm | |
Minimum line width | 4mils (1oz Cu finished) | |
Minimum Line gap | 4mils(1oz Cu finished) | |
Outer layer copper thickness | 1/3-12OZ | |
Inner layer copper thickness | 1/3-14OZ | |
Min. finished hole size (Mechanical) | 0.20mm | |
Min. finished hole size (laser hole) | 0.075mm | |
Aspect ratio | 10:01 | |
Solder Mask Types and brand | Nanya,Taiyo | |
Solder Mask Color | Gloss & matte green | |
Impedance Control Tolerance | 10% | |
Surface Treatment | HASL lead free,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger | |
V-Cut | V-cut degree | 30+/-5 degree |
Tol: +/-0.13mm | ||
Chamfer | The angle type of the chamfer | 20,30, 45 Degree |
Plug via hole | Min. size can be plugged | 0.15mm |
Max. size can be plugged | 0.50mm | |
Largest NPTH hole size | 6.50mm | |
Largest PTH hole size | 6.50mm | |
Min. annular ring can be kept | 6mils | |
Min. distance between the IC pads can keep SM bridge | 8mils | |
Min. SM bridge for green soldermask | 4 mils | |
Min. SM bridge for black soldermask | 5mils | |
Tolerance of outer dimension size | Tol: +/-0.13mm | |
Tolerance of board thickness | T>=1.0mm, Tol: +/-10% T<1.0mm, Tol:+/-0.1mm | |
Tolerance of finished PTH hole size | Tol: +/-0.075mm | |
Specila Progress | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and Resistance contro |