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Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB
Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB
Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB
Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB
Specifications
Brand Name :
Customized
Model Number :
Customized
Certification :
ISO9001/ISO14001/CE/RoHs
Place of Origin :
Shenzhen,China
MOQ :
1pcs
Price :
negotiable
Payment Terms :
T/T
Supply Ability :
10,000 sq meter per month
Delivery Time :
1-7 days
Packaging Details :
Anti-static film/bag or pallet in carton
Product name :
Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB
Number of Layers :
Multi layer PCB
Min space betweeen BGA and PINS :
0.3mm
Max High speed signal :
60GHZ
Min line width/space :
2.4/2.4mil
Max linked qty :
78000+
Max BGA-PIN qty :
2912
Description

Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB

1.Description
Our products include:2-32 Layers PCB board that Rigid, FPC, Rigid-flex PCB.The Products are extensively used in various industries such as: Automative, Telecommunication, Medical, Power supply, Industrial contorl equipment and Consumer electronics.
2.Product Image
Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB
3.Technical sheet
Item Technical Specification
Number of Layers 2-32 layers
Laminate

CEM-3,FR4 (High Tg, Halogen Free),Rogers,Teflon, Arlon, Metal Base (Aluminum, Copper), Mixematerial

Kapton, PI, PET for flex.
Laminate Brand KB,Shengyi,Nanya,Isola,Goword,grace,Rogers,Arlon,Taconic,Ventec and customer specify
Maximum board size

610X1060mm
Board thickness 0.15-4.5mm
Minimum line width 4mils (1oz Cu finished)
Outer layer copper thickness 1/3-12OZ
Inner layer copper thickness 1/3-14OZ
Min. finished hole size (Mechanical) 0.20mm
Min. finished hole size (laser hole) 0.075mm
Aspect ratio 10:01
Solder Mask Types and brand Nanya,Taiyo
Solder Mask Color Gloss & matte green
Impedance Control Tolerance 10%
Surface Treatment HASL lead free,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Largest PTH hole size 6.50mm
Min. annular ring can be kept 6mils
Min. SM bridge for black soldermask 5mils
Tolerance of outer dimension size Tol: +/-0.13mm
Tolerance of board thickness T>=1.0mm, Tol: +/-10%
T<1.0mm, Tol:+/-0.1mm
Tolerance of finished PTH hole size Tol: +/-0.075mm
Specila Progress Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and Resistance contro

Please send the Gerber files & Specification to us for quick offer.

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Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB

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Product Detail
Brand Name :
Customized
Model Number :
Customized
Certification :
ISO9001/ISO14001/CE/RoHs
Place of Origin :
Shenzhen,China
MOQ :
1pcs
Price :
negotiable
Contact Supplier
Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB
Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB

Shenzhen Fany Technology Co.,Ltd

Active Member
7 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer
Main Products :
FR4 Multilayer PCB, HDI PCB Board, Double Sided PCB
Total Annual :
2000000-3000000
Employee Number :
200~500
Certification Level :
Active Member
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