Carbon Oil Electro Mechanical Fr4 PCB , Motor Control pcb double layer Board
Quick detail:
Origin:China | Special: FR4 Material |
Layer:2 | Thickness:1.6mm |
Surface: HASL-LF | Hole:0.5 |
Specification:
Carbon Oil Electro-Mechanical Green Soldermask White Silkscreen Motor Control Board,FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
Carbon Oil Electro-Mechanical Green Soldermask White Silkscreen Motor Control Board,Indian Oil is the use of carbon-screen printing technology, the position designated PCB board printed carbon oil, carbon film has a qualified resistance is formed after curing oven test OK instead of the original resistive element. Production and printing of characters similar, the difference is only carbon oil has good electrical conductivity, and the character is a semiconductor material, logo and separated only play the role of welding.
Specification:
Layer: 2
Color: Green
Line width: 5mil
Line space: 5mil
Hole: 0.2MM
Carbon Oil Electro-Mechanical Green Soldermask White Silkscreen Motor Control Board
The main parameters of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example)
Yellow and white core plate divided core material, usually white core material;
Sheet Size: 36 "* 48", 40 "* 48", 42 "* 48", 37 "* 49", 41 "* 49", 43 "* 49";
Thickness: 0.10mm, 0.10MM behind by increments, usually the thickest of 3.20mm, 0.30mm or less can do multilayer core board, 0.60MM surface treatment can not do the following HAL, complete the following press thickness 1.00mm thickness the thickness of ± 0.10,1.00mm by more than ± 10%;
Sheet copper thickness: 1 / 3OZ-12um, 1 / 2OZ-17.5um, 1OZ-35um, 2OZ-70um, 3OZ-105um, etc;
TG value: glass transition temperature, the material begins to be interpreted as a softening point of the glass as the temperature in the molten state. Normal TG (≤140 ℃), the TG (150 ℃), high TG (≥170 ℃)
CTI Definition: comparative tracking index; divided into six grades: 1 (CTI≥600V), 2 (600V> CTI≥400V), 3 (400V> CTI≥250V), 4 (249V> CTI≥175V), 5 ( 175V> CTI≥100V), 6 (100V> CTI≥0V);
Dielectric constant (Er): general value 4.2-4.5;
Thermal decomposition temperature (TD): typ. 305 ℃;
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Features
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Standard E-glass
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Rogers material in stock:
Brand | Model | Thickness(mm) | DK(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 |
RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
RO5880 | 0.254.0.508.0.762 | 2.2 | |
RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
RO3010 | 0.635 | 10.2 | |
RO3206 | 0.635MM | 10.2 | |
R03035 | 0.508MM | 3.5 | |
RO6010 | 0.635MM, 1,27MM | 10.2 |