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FR4 Material PCB High TG Electronic Prototype Pcb Fabrication
FR4 Material PCB High TG Electronic Prototype Pcb Fabrication
FR4 Material PCB High TG Electronic Prototype Pcb Fabrication
FR4 Material PCB High TG Electronic Prototype Pcb Fabrication
Specifications
Brand Name :
XCE
Model Number :
XCE BG78
Certification :
CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
MOQ 1 Piece
Price :
Negotiation
Payment Terms :
T/T, Western Union
Supply Ability :
1000000 pieces per week
Delivery Time :
5-10 working days
Packaging Details :
1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color :
Green
Material :
Fr4 Material
Layer :
4
Board Size :
6*6cm
Copper Thinknes :
1 oz
Min Line Width :
4 mil
Min Line Space :
4mil
Surface Finish :
Immersion Gold
Name :
Fr4 pcb
Description

4 Layer FR4 Material PCB With High TG Electronic Prototype Pcb Fabrication

Quick Detail :
1. Type : Pcb
2. Material : FR4
3. Layer : 4
4. Products Size :6*6cm
5. Permittivity : 2.5
6. Surface finish : Immersion Gold

Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 2.5 dielectric conductivity much more precision .

Parameter:

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254 0.508 0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2


Description :

The standard FR-4 material that is used in our PCBExpress® Quickturn, ValueProto® and the default material for our PCBpro® Full Feature products is a high temperature, high Td, low CTE 150Tg material.

If a higher Tg material is required, we do stock a 170Tg version of our standard FR-4 material as well, that can be substituted in our PCBpro Full Feature and Custom Quote products (provide a readme file or a print note specifying the 170 Tg material). There may be a material lead time for some specific sizes or thickness, and may impact due date.

FR-4 (or FR4) is a grade designation assigned to glass-reinforced epoxy laminate sheets, tubes, rods and printed circuit boards (PCB). FR-4 is a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant (self-extinguishing).



PrePreg Material
It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

Properties:

· High Glass Transition Temperature (Tg) (150Tg or 170Tg)

· High Decomposition Temperature (Td) (> 325º C)

· Low Coefficient of Thermal Expansion (CTE) ((3.0%-3.8%)

· Dielectric Constant (@1 GHz): 4.25-4.55

· Dissipation Factor (@ 1 GHz): 0.016

· UL rated (94V-0, CTI = 4)

· Compatible with standard and lead-free assembly.

· Laminate thickness available from 0.005” to 0.125”

· Pre-preg thicknesses available (approximate after lamination):

• (1080 glass style) 0.0022”

• (2116 glass style) 0.0042”

• (7628 glass style) 0.0075”

150 Tg FR-4 material is used on all standard PCBExpress Quickturn, ValueProto and all PCBpro Full Feature orders unless another specific material or Tg is called out (PCBpro Full Feature or Custom Quote).

Specifications:

When ordering a copper clad laminate board, the FR-4 thickness and the copper foil thickness must be specified separately.

In the USA, FR-4 thickness is specified in thou or inches, and common thicknesses range from 10 thou (0.010 in, 254 µm) to 3 inches (76 mm).

In the USA, copper foil thickness is specified in units of ounces per square foot (oz/ft2), commonly referred to simply as ounce. Common thicknesses are 1 oz/ft2(300 g/m2), 2 oz/ft2 (600 g/m2), and 3 oz/ft2 (900 g/m2). These work out to thicknesses of 34.1 µm (1.34 thou), 68.2 µm (2.68 thou), and 102.3 µm (4.02 thou), respectively. Some PCB manufacturers refer to 1 oz/ft2 copper foil as having a thickness of 35 µm (may also be referred to as 35 μ, 35 micron, or 35 mic).

· 1/0 - denotes 1 oz/ft2 copper one side, with no copper on the other side.

· 1/1 - denotes 1 oz/ft2 copper on both sides.

· H/0 or H/H - denotes 0.5 oz/ft2 copper on one or both sides, respectively.

· 2/0 or 2/2 - denotes 2 oz/ft2 copper on one or both sides, respectively.

Key Benefits:

  • High dielectric constant for circuit size reduction
  • Low loss. Ideal for operating at X-band or below
  • Tight εr and thickness control for repeatable circuit performance

Typical Applications:

  • Automotive radar applications
  • Global positioning satellite antennas
  • Cellular telecommunications systems - power amplifiers and antennas
  • Patch antenna for wireless communications
  • Direct broadcast satellites
  • RFID Tags
  • Surface mount RF components
  • E-Band point to point microwave links

Production Description :

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane 0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s



Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.


Product tags

fabrication fr4 pcb

,

manufacture of multilayer pcb

,

fr4 pcb material online
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FR4 Material PCB High TG Electronic Prototype Pcb Fabrication

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Product Detail
Brand Name :
XCE
Model Number :
XCE BG78
Certification :
CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
MOQ 1 Piece
Price :
Negotiation
Contact Supplier
FR4 Material PCB High TG Electronic Prototype Pcb Fabrication
FR4 Material PCB High TG Electronic Prototype Pcb Fabrication

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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