High Frequency Microwave RF PCB F4B ER = 2.2 Permittivity 4 Layer Pcb
Quick Detail :
Type | Pcb |
Material | F4B |
Layer | Multilayer |
Size | 12*5cm |
Permittivity | 2.2 |
Color | Green |
Surface Finish | ENIG |
Features:
RO3035™ high frequency circuit materials are ceramic- fi lled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.
RO3000® series laminates are ceramic-fi lled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multilayer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems.
Parameter:
Model | Parameter | thickness(mm) | Permittivity(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
TACONIC | TLF-35 | 0.8 | 3.5 |
TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
RF-60A | 0.64 | 6.15 | |
TLY-5 | 0.254,0.508,0.8 | 2.2 | |
TLC-32 | 0.8,1.5,3 | 3.2 | |
TLA-35 | 0.8 | 3.2 |
Description :
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Data :
Layer | 1 to 28 layers |
Material type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
Board thickness | 0.21mm to 7.0mm |
Copper thickness | 0.5 OZ to 7.0 OZ |
Copper thickness in hole | >25.0 um (>1mil) |
Size | Max. Board Size: 23 × 25 (580mm×900mm) |
Min. Drilled Hole Size: 3mil (0.075mm) | |
Min. Line Width: 3mil (0.075mm) | |
Min. Line Spacing: 3mil (0.075mm) | |
Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
Tolerance
| Shape tolerance: ±0.13 |
Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
Certificate | UL, ISO 9001, ISO 14001 |
Special requirements | Buried and blind vias+controlled impedance +BGA |
Profiling | Punching, Routing, V-CUT, Beveling |
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products. |
Typical Applications:
Production Description :
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Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Detailed Images :
Payment Term :