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High TG 4 layer immersion gold pcb Used In Microvawe And RF With Stable Permittivity
High TG 4 layer immersion gold pcb Used In Microvawe And RF With Stable Permittivity
High TG 4 layer immersion gold pcb Used In Microvawe And RF With Stable Permittivity
High TG 4 layer immersion gold pcb Used In Microvawe And RF With Stable Permittivity
Specifications
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Payment Terms :
T/T,Western union
Supply Ability :
1, 000, 000 PCS / week
Delivery Time :
5-10 days
Packaging Details :
inner: vacuum-packed bubble bag outer: carton box
Material :
Rogers
Layer :
4
Color :
Green
Min line space :
4mil
Min line width :
4mil
Copper thickness :
1OZ
Board size :
150*51mm
Panel :
1
Surface :
ENIG
Description

High TG 4 layer immersion gold pcb Used In Microvawe And RF With Stable Permittivity

Quick detail:

Origin:China Special: High frequency pcb
Layer:4 Thickness:0.254mm
Surface: ENIG Hole:0.2

Specification:

High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

High frequency materials are UL 94V-0 rated for active devices and high power RF designs.

Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • Microwave point to point (P2P) links
  • Automotive Radar and Sensors
  • low dielectric loss
  • RF Identification (RFID) Tags
  • The stability of the dielectric constant
  • An extremely low water imbibition
  • LNB’s for Direct Broadcast Satellites

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.

Parameter:

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size: (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance: ±0.13
13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

Features

• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program

Rogers material in stock:

Brand Model Thickness(mm) DK(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO4003 0.254 0.508,0.813,1.524 3.38
RO4350 0.254 0.508,0.762,1.524 3.5
RO5880 0.254.0.508.0.762 2.2
RO3003 0.127,0.508,0.762,1.524 3
RO3010 0.635 10.2
RO3206 0.635MM 10.2
R03035 0.508MM 3.5
RO6010 0.635MM, 1,27MM 10.2

Product tags

immersion gold multilayer pcb

,

four layer immersion gold pcb

,

6 layers immersion gold pcb
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High TG 4 layer immersion gold pcb Used In Microvawe And RF With Stable Permittivity

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Product Detail
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Contact Supplier
High TG 4 layer immersion gold pcb Used In Microvawe And RF With Stable Permittivity
High TG 4 layer immersion gold pcb Used In Microvawe And RF With Stable Permittivity

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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