Double Sided PCB Prototype With Rogers 4003C 0.203mm Gold Plated Finish

Quick detail:

Parameter:

Files:Gerber,protel,powerpcb,Autocad,etc.

Material:FR-1,FR-4,CEM-1,CEM-3,HI-TG,Aluminum

Layer count:1-24 layers multilayer pcb

Max.Panel Size:450*1500mm

Board Thickness:0.2-5mm

Min. Core Thickness:0.075mm

Cu Thickness:12-140um

Min. Drill Size:0.2mm

Max. Aspect Ratio: 8:1

Min. Trace Width: 0.1mm

Min line spacing:0.075mm

Min. SMT/QFP Pitch:0.4mm

v Fast PCB Fabrication for Samples and Mass Production

v Electronic Components Sourcing Services

v PCBA Assembly Services:SMT,DIP,BGA...

v Function Test

v Stencil,Cable and Enclosure Assembly

v Reverse engineering service

v Standard Packing and On time Delivery

Typical Applications

• Cellular Base Station Antennas and Power Amplifiers
• Microwave point to point (P2P) links
• Automotive Radar and Sensors
• RF Identification (RFID) Tags
• LNB’s for Direct Broadcast Satellites

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.

Features

• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program