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HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via
HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via
HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via
HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via
Specifications
Brand Name :
XCE
Model Number :
XCE BK
Certification :
CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
MOQ 1 Piece
Price :
Negotiation
Payment Terms :
T/T, Western Union
Supply Ability :
1000000 pieces per week
Delivery Time :
5-10 working days
Packaging Details :
1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color :
Yellow
Material :
FR4 Material
Layer :
4
Board Size :
53*61cm
Copper Thinknes :
1 oz
Min Line Width :
4 mil
Min Line Space :
4mil
Surface Finish :
Immersion Silver
Name :
FR4 pcb
Description

HF High 150 TG FR4 Material With 3 mm Blind Buried Hole Via

Products Details

We are the highest efficience pcb manufature here .

(1) Professional Manufacturer on PCB for about 10 years

(2) More than 500 workers, over 4,000 square meters for day-output and 1,000,000 square meters for year-output.

(3) Plant passed passed ISO/TS16949: 2000 and ISO14001: 2004
and products meet IPC-A-600F, IPC-D-600G, MIL-STD-105D LEVEL II, UL and SGS Certification

OME Manufature

a. We manufacture PCB,PCBA,Singe/Double side PCB, Multilayer PCB,Aluminium PCB,Spray Tin PCB,Immersed Gold PCB,HDI Mobilephone PCB,Gold-plating PCB,(printed circuit board with assembly) PCBA,SMT PCBA,DIP PCBA,PCB&PCBA Copy,PCB Assembly,OSP,HASL,etc.

b. Expert circuit board testing, high quality factory wholesale price

c. PCB OEM&ODM Clone/Copy, conform to UL,SGS,RoHS

We offer our customers a wide range material and boards:

1. Single-sided, double-side, multi-layer PCB & Aluminium LED PCB

2. HASL, HAL lead free, OSP, Immersion Gold/ Silver/ Tin surface finish available

3. Base Materials: FR4, High TG FR4,CEM-1, CEM3, Aluminum(metal core)

4. Aluminum PCB board thickness from 0.8mm-3.6mm

5. Quantity from prototype to volume production

6. Fast turnaround time, prompt delivery, high quality at competitive price Detailed Specification of PCB Manufacturing



PrePreg Material

Parameter Standard Spec (mm)
Layer 4 L
DHI stack 3
Board thinckness 3.0
Max work panel size 530×610
Aspect ratio 12:1
L/S 0.07/0.07
Surfce finish OPS,ENIG,Hard gold
Material FR-4
Inner packaging Vacuum
Solder masker Green/ Black/ Red/ Yellow/ White/Blue
Outgoing reports Final inspection,solderability test,micro section test ,thermal stresses test and more


Performance characteristics
Glass Transition Temperature (Tg) 150Tg or 170Tg
Decomposition Temperature (Td) > 325℃
Coefficient of Thermal Expansion (CTE) 3.0%-3.8%
Dielectric Constant (@1 GHz) 4.25-4.55
Dielectric Constant (@55 GHz) ≤5.5
Dissipation Factor (@ 1 GHz) 0.016
Water imbibition (D - 24/23, the thickness of 1.6 mm) ≤19mg
Laminate thickness 0.005”~ 0.125”
Combustibility FV0
Density 1.70-1.90g／cm&sup3
Vertical Layer To The Bending Strength A Normal :E-1／150,150±5℃≥340Mpa
Parallel To The Floor To The Impact Strength (beam) ≥233KJ／m
Execution Standard GB/T1303.1-1998
After Flooding Insulation Resistance D-24／23):≥5.0×108Ω
Vertical layer to the electric strength (in the middle of 90 + 2 ℃ for transformer oil, thickness 1 mm) ≥14.2MV／m
Parallel layer to the breakdown voltage (90 + 2 ℃ in the transformer oil) ≥40KV

Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Product tags

blind hole pcb

,

fabrication fr4 pcb

,

pcb hole size
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HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via

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Product Detail
Brand Name :
XCE
Model Number :
XCE BK
Certification :
CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
MOQ 1 Piece
Price :
Negotiation
Contact Supplier
HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via
HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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