Half Hole Technology Rogers PCB Circuit Boards With High Frequency Substrate
RT/duroid® 5880LZ materials have the lowest Dk for a copper clad laminate available in the market today. Because of its low dielectric constant of 1.96 at 10 GHz, RT/duroid 5880LZ supports broadband applications at the microwave through millimeter-wave frequencies where dispersion and circuit losses must be minimized. It is a lightweight, PTFE-based composite optimized with a unique filler that provides very low density (1.37 gm/cm3) and a low coefficient of thermal expansion (CTE) in the Z-axis. This makes 5880LZ well suited for fabricating high-frequency circuits with plated-through holes (PTH) and allows higher vehicle payloads. In addition, the dielectric constant is uniform from panel-topanel and constant over a wide frequency range, with a low Z-axis TCDk of +22 ppm/°C. Its low dissipation factor extends the usefulness of RT/duroid 5880LZ to Ku-band and above.
Advantage
Rogers 5880 pcb substrate superiority
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
We can supply:
Rogers High Frequency Laminate/Material
High frequency pcb manufacture
PCB assembly
Specification:
Layer: 10
Color: black
Line width: 3mil
Line space: 3mil
Hole: 0.15MM
Rogers pcb
Rogers 5880 pcb Which widely be used for :
Automotive Antennas / RFID
Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability
Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital
XCE PCB technical specification | |||||||||
Annual stock meterial | Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free | ||||||||
Layer No. | 1-16 | ||||||||
Min board thickness | 2 layer 0.2mm | ||||||||
4 layer 0.4mm | |||||||||
6 layer 0.6mm | |||||||||
8 layer 0.8mm | |||||||||
10 layer 1.0mm | |||||||||
Max panel size | 508*610mm | ||||||||
Board thickness tolerance | T≥0.8mm±8%,T<0.8mm±5% | ||||||||
Wall hole copper thickness | >0.025mm(1mil) | ||||||||
Finished hole | 0.2mm-6.3mm | ||||||||
Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
Min bonding pad space | 0.1mm(4mil) | ||||||||
PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
Hole site deviation | ±0.05mm(2mil) | ||||||||
Profile tolerance | ±0.10mm(4mil) | ||||||||
Board bend&warp | ≤0.7% | ||||||||
Insulation resistance | >1012Ωnormal | ||||||||
Through-hole resistance | <300Ωnormal | ||||||||
Electric strength | >1.3kv/mm | ||||||||
Current breakdown | 10A | ||||||||
Peel strength | 1.4N/mm | ||||||||
Soldmask regidity | >6H | ||||||||
Thermal stress | 288℃20Sec | ||||||||
Testing voltage | 50-300v | ||||||||
Min buried blind via | 0.2mm(8mil) | ||||||||
Outer cooper thickness | 1oz-5oz | ||||||||
Inner cooper thickness | 1/2 oz-4oz | ||||||||
Aspect ratio | 8:1 | ||||||||
SMT min green oil width | 0.08mm | ||||||||
Min green oil open window | 0.05mm | ||||||||
Insulation layer thickness | 0.075mm-5mm | ||||||||
Aperture | 0.2mm-0.6mm | ||||||||
Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating |