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Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects
Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects
Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects
Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects
Specifications
Brand Name :
XCE
Model Number :
XCE
Certification :
CE/ROHS/SGS/MSDS/UL
Place of Origin :
China
MOQ :
1pc
Price :
negotiation
Supply Ability :
1000000pcs/month
Packaging Details :
anti-static pacni
Material :
Rogers series
Layer :
2-48layers
Smallest pad size :
.001″ /size (.001″ / 0.025mm annular ring) 0.025mm annular ring
Smallest finished via :
.004″ / 0.102mm
Inner layer pads :
025″ / 0.635mm oversize minimum
Description

XCE specialize in manufacturing various hi-frequency PCB and multilayer board including fastest sample products. Provides you with a unique one stop solution to all your printed circuit needs, including PCB manufacturing and assembly.

Radar microwave circuit board (PCB) production,Doppler sensor module LED light board,5.8G,24G sensor board, speed electronic dog motherboard,Rogeros high frequency board,Taconic high frequency board, TP-2 special media board,Board,F4B domestic high-frequency board,Rogeros and FR4 mixing plate,4G antenna high frequency board,4G base station high frequency board.

Highlights:

Rigid PCB–2 Layer to 48 Layers

Blind/buried via

Backplane

High Density Interconnects (HDI)

Board thickness 8mm

Maximum copper thickness 8 oz

PCB surface finish:

HASL

Leadfree HASL

OSP

ENIG Immersion Gold

Immersion tin

Flash gold

Laminate Materials:

FR4 Normal and high-TG

Rogers

Taconic

Isola

F4B

Special requirements:

Peelable solder mask

Carbon ink

Buried capacitor/resistor

Quality Standard certifications:

ISO9001

QS9000

ISO14001

TS16949

AS9100

UL Underwriter Laboratories

IPC-600 Class 2 Standard manufacturing specifications
IPC-600 Class 3 Available as required
IPC-6012 Available as required with in-house testing capabilities

Inner layer pads 025″ / 0.635mm oversize minimum
Smallest finished via .004″ / 0.102mm
Standard pad size (.002″/ 0.051mm annular ring) 0085″ / 0.216mm annular ring (.017″ / 0.432mm oversize)
Smallest pad size (.001″ / 0.025mm annular ring) .0075″ / 0.191mm annular ring (.015″ / 0.038mm oversize)
Standard line and spacing .005″ / .005″ (0.127mm / 0.127mm)
Special line and spacing .003″ / .003″ (0.076mm / 0.076mm)
Product tags

6 layers immersion gold pcb

,

four layer immersion gold pcb

,

1.6mm thick multilayer pcbs
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Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects

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Product Detail
Brand Name :
XCE
Model Number :
XCE
Certification :
CE/ROHS/SGS/MSDS/UL
Place of Origin :
China
MOQ :
1pc
Price :
negotiation
Contact Supplier
Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects
Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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