Specifications
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Payment Terms :
T/T,Western union
Supply Ability :
1, 000, 000 PCS / week
Delivery Time :
5-10 days
Packaging Details :
inner: vacuum-packed bubble bag outer: carton box
Material :
Taconic
Layer :
2
Color :
Black
Min line space :
5mil
Min line width :
5mil
Copper thickness :
1OZ
Board size :
279*88mm
Panel :
1
Surface :
Immersion Tin
Description

2 Layer Taconic Radio Frequency Board

TACONIC high-performance insulation materials for the microwave,

radio frequency (RF) and high-speed digital signal processing market PTFE / woven glass fiber woven

sheet.

Customize Taconic PCB Board,we can according to your gerber file,tell us the quantity,size,finished surface,we will Customize TLX-8,TLX-9,TLC-32,TLY-5,RF-60A,CER-10,RF-30,TLA-35 PCB board,use to Antenna, radar, microwave, suitable for high-speed signal transmission,Taconic Board design requirements: multi-layer design of the prepreg dielectric constant, according to the way to calculate the actual mixing dielectric constant and impedance

Radio Frequency board is RF Board, referring to the radio frequency, high frequency signal. See the performance requirements of the circuit board can be ordinary FR4 epoxy glass fiber, Teflon can also be a special microwave substrate.In addition to the general principle of printed circuit board on the RF circuit PCB - consider the current size, but also must consider the characteristic impedance of the printed line, strict impedance matching, printed circuit impedance control must be considered in the PCB production. The characteristic impedance of the printed wire is related to the material properties and physical parameters of the PCB, so the PCB designer must know the performance of the PCB

RF board standard:

1, low-power RF PCB design, the main use of standard Taconic material

2, RF PCB, the various components should be arranged closely to ensure that the connection between the various components the shortest.

3. For a mixed-signal PCB, the RF part and the analog part should be far away from the digital part (the distance is usually at least 2cm, at least 1cm). The ground of the digital part should be separated from the RF part.

4, in the choice of components in high-frequency environment, the use of surface mount devices as much as possible. This is because the surface mount components are generally small in size and the leads of the components are short.

Specifications Technology Notes
Number of Layers 1-40 Layers
Board Materials

FR4 (Tg – 135C, 145C, 170C, 180C)

Rogers RO4350

Rogers RO4003

Rogers5880

Rogers3003

Rogers3010

F4B

Taconic:TLX-8,TLX-9,TLC-32,TLY-5,RF-60A,CER-10,RF-30,TLA-35

Teflon

Arlon AR350

We normally keep these materials in stock. If you need a material that is not listed here, please contact us and we can order it for you.
Final PCB Thickness

2 Layer – Min .005” Max .250”

4 Layer – Min .015” Max .250”

6 Layer – Min .025” Max .250”

8 Layer – Min .031” Max .250”

10 Layer – Min .040” Max .250”

12 Layer – Min .047” Max .250”

14 Layer – Min .054” Max .250”

16 Layer – Min .062” Max .250”

18 Layer – Min .093” Max .250”

20 Layer – Min .125” Max .250”

22 Layer – Min .125” Max .250”

>24 Layer – Min .125” Max .250”

Core Thickness Min .0025”
Maximum PCB Size

2 Layer 20” x 28”

Mulitlayer 16” x 26”

Minimum Conductor Space 0.003”
Minimum Conductor Width 0.003”
Minimum Drill Hole Size 0.006”
Finish Plating / Surface Finishes

HASL – Leaded Solder Tin/Nickel

HASL – Lead Free Solder

Electroless Soft Gold

Wire Bondable Soft Gold

Nickel Flash Gold

Electroless Nickel

Immersion Gold OSP

Electrolytic Nickel /Hard Gold and Selective Gold

Immersion Silver

Immersion Tin

Carbon Ink

ENIG

Finished Copper – Outer Layers

1oz Cu – Min .004” Trace/Space

2oz Cu – Min .005” Trace Space

3oz Cu – Min .008” Trace/Space

4oz Cu – Min .010” Trace/Space

5oz Cu – Min .012” Trace/Space

We can manufacture higher ounces of copper depending on the specs. Please let us know how much you would like when sending us your PCB specs.
Finished Copper – Inner Layers

.5oz Cu – Min .004” Trace/Space

1oz Cu – Min .005” Trace/Space

2oz Cu – Min .006” Trace/Space

3oz Cu – Min .010” Trace/Space

4oz Cu – Min .012” Trace/Space

Inner Layer Clearances

Min .008”

Minimum Finished Hole Size

Final Thickness <=.062” – .006’ Hole Final Thickness .150” – .014” Hole

Final Thickness .093” – .010” Hole Final Thickness .200” – .018” Hole

Final Thickness .125” – .012” Hole Final Thickness .250” – .020” Hole

Gold Fingers 1 to 4 edges
Solder Mask Type

Per IPC-SM-840

LPI Soldermask

Peelable Soldermask

Solder Mask Colors

Green/Green

Matte White

Black/Black

Matte Clear

Blue Top and Bottom Mix

Red One or Both Sides Mix

Silkscreen Type

Thermal Cure Epoxy Ink

LPI Ink

Silkscreen Colors

White

Black

Yellow Top and Bottom Mix

Red One or Both Sides Mix

Blue

CNC Functions

Scoring Edge to Edge Plated Counter bores

Skip Scoring – .250” Spacing Milling

30 or 60 Degree Score Angle Blind and Buried Vias

30 to 100 Degree Countersink Controlled Z Axis Route

15 to 45 Degree Gold Finger Bevel Castellated Barrels

Counterbores Offset or Recessed Beveling

Plated Countersinks

Other PCB Services

Blind and Buried Vias

Plated Slots Specified Dielectric

Tented Vias Controlled Impedance

Solder mask Plugged Vias Via Caps (Solder Mask)

Conductive Filled Vias

Quality / Testing

Inspect to IPC Class III Continuity Resistance – 10 to 20 Ohms

Net List Test per IPC-356D Isolation Resistance – 2 to 30 Megaohms

Test Voltage – 100 to 250 Volts Minimum SMT Pitch 0.5 mm

Tolerances

PTH Hole Size – +/- .002”

Front to Back – +/- .002”

NPTH Hole Size – +/- .001”

Solder Mask – +/- .002”

Tooling Holes – +/- .001”

Hole to Pad – +/- .005”

QUALITY GUARANTEED

Labview control software and GUI for instrument control and test routines

ISO 9001:2008 certification

UNE.EN 9100 certification

Application of MIL standards as needed

Application of ECSS standards as needed

Airborne / space / ground equipment

Hi-Rel design and manufacturing procedures

Why Choose Us?

1. Your inquiry related to our products or prices will be replied in 24hrs.

2. Well-trained and experienced staffs to answer all your enquires in fluent English

3. OEM&ODM, we can help you to design and put into product.

4. Distributorship are offered for your unique design and some our current models

5. Protection of your sales area, ideas of design and all your private information

Trade Terms:

1. Payment: T/T in advance (Western Union , PayPal is welcomed)

2. Sample can be delivered in 3 days

3. Shipping freight are quoted under your requests

4. Shipping port: Shen zhen,Mainland China

5. Discounts are offered based on order quantities

6. MOQ: 1PCS

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2 Layer Taconic Radio Frequency Board Making Printed Circuit Boards

Ask Latest Price
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Contact Supplier
2 Layer Taconic Radio Frequency Board Making Printed Circuit Boards

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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