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Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Specifications
Brand Name :
XCE
Model Number :
XCET
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pc
Price :
negotiation
Supply Ability :
1, 000, 000 PCS / week
Packaging Details :
inner: vacuum-packed bubble bag outer: carton box
Material :
Rogers4350B+ FR4
PCB layer :
1-28layers
Min. Hole Size :
0.15mm
Board size :
Min 6 x 6mm | Max 457 x 610m
Surface Finishing :
ENIG, Immersion silver, etc.
Copper Thickness :
0.5oz - 2.0oz
Assembly Option :
yes
Electronics Source :
yes
Description

High density PCB FR4 4layers Fine Pitch ENIG PCB for wireless router

Layer: 4

Material:FR4

Outer Track W/S:3.5/4mil

Inner Track W/S 4/3.5mil

Board Thickness: 1.6mm

Min. Hole Diameter: 0.25mm

Application Industry: Consumer Electronics

Application Products: Wireless Router

HDI PCB is among the fastest growing PCBs on the market because it meets complex design needs. This kind of high density interconnect printed circuit board allows designers to place more components in a smaller area. Having a higher circuitry density than conventional PCBs, it's able to incorporate finer lines and spaces, smaller vias & capture pads, and higher connection pad densities. It contains blind/buried vias and is often with 6 mil microvias.

HDI custom PCB is widely used to reduce the weight and overall dimensions of products, as well as enhancing the electrical performance of the device. It's regularly found in mobile phones, touch-screen devices, and 4G network communications.

XCEPCB offers HDI custom PCB fabrication with microvias down to 4 mil; laser drilling is required.

HDI Structures

HDI Structures Type of micorovias Mass production Middle/small batch Prototype Apply to
1+N+1 Blind vias Yes Yes Yes 4 layers+
2+N+2 Blind/Buried staggered vias Yes Yes Yes 6 layers+
2+N+2 Blind/Buried stacked vias Yes Yes Yes 6 layers+
3+N+3 Blind/Buried staggered vias / Yes Yes 8 layers+
3+N+3 Blind/Buried stacked vias / / Yes 8 layers+

Our PCB Application:

  • Telecom: transmitter. Receiver. Oscillator. Antenna.
  • Satellite receiver
  • Global location system, amplifier, satellite telecom
  • Microwave transmission
  • Automobile telephone
  • Measure apparatus, LSI inspector, analyser, signal oscillator
  • High frequency teletcom, high speed transmission, high security, high transmission quality, high memory transaction

We can offer production with high quality and competitive:

Item Mass Production Pilot Run Production
Capacity Capacity
Layer Counts 1L_20L, HDI 20-28 , HDI
Material FR4
Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc.
Material Mixed Laminate 4 layers -- 10 layers 12 layers
FR4+Ro4350 , Rogers3003+FR4
Maximum Size 610mm X 1200mm 1200 - 2000MM
Board Outline Tolerance ±0.15mm ±0.10mm
Board Thickness 0.125mm--6.00mm 0.1mm--8.00mm
Thickness Tolerance ( t≥0.8mm) ± 8% ±5%
Thickness Tolerance( t<0.8mm) ±10% ±8%
Minimum Line / Space 0.10mm 0.075mm
Trace width Tolerance 15%-20% 10%
Minimum Drilling Hole (Mechanical) 0.2mm 0.15mm
Minimum laser hole 0.1mm 0.075mm
Hole Position/hole Tolerance ±0.05mm PTH:±0.076MM NPTH:±0.05mm
Mini hole ring (single 0.075MM 0.05MM
OutLayer Copper Thickness 17um--175um 175um--210um
InnerLayer Copper Thickness 17um--175um 175um--210um
Mini Solder Mask Bridge 0.05mm 0.025mm
Impedance Control Tolerance ±10% ±5%
Surface Finishing HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
Plated gold , OSP, Carbon ink
1-2L Lead-time 3-7 days 1-2 days
4- 8L Lead-time 7-10 days 2-7 days
10-18L Lead-time 10-15 days 4-9 days
20-28L Lead-time 15-20 days
Acceptable File Format ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc.
Quality Standards IPC-A-600F and MIL-STD-105D CHINA GB<4588>

Our service:

Offering comprehensive range of PCB, HDI, high frequency circuit board(Our Advantage products Milspec PCB), impedance board, high TG board, thick copper board, multilayer board, soft and hard board, blind hole plate etc.

We provide one stop solution to all printed circuit needs, PCB &PCBA assembly service and component sourcing, to optimize product performance and shorten time-to market.

Application:

Communication equipment, Computers, Telecom Base Station, Industrial control, Power electronics, Household appliances, Automobiles, Medical instruments, Security electronics and Aerospace etc.

Notes:

Gerber file,components list and specification about PCB/PCBA is required for quotation.

Application Industry: Consumer Electronics

Application Products: Wireless Router

Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router

Product tags

pcb antenna design guide

,

pcb rf design

,

router pcb board
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Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router

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Product Detail
Brand Name :
XCE
Model Number :
XCET
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pc
Price :
negotiation
Contact Supplier
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router
Fine Pitch ENIG Custom PCB Boards 4 Layer High Density For Wireless Router

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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