Electro Mechanical Assembly PCBA for Equipment Control Mixed PCB Assembly
Quick detail:
Origin:China | Special: PCB Assembly |
Layer:2 | Thickness:1.6mm |
Surface: HASL-LF | Hole:0.8 |
PCB Assembly Details:
Standard Component Sourcing Service
Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware
Technical Requirement for PCB Assembly:
v Professional Surface-mounting and Through-hole soldering Technology
v Various sizes like 1206,0805,0603,0402,0201 components SMT technology
v ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
v PCB Assembly With UL,CE,FCC,Rohs Approval
v Nitrogen gas reflow soldering technology for SMT.
v High Standard SMT&Solder Assembly Line
v High density interconnected board placement technology capacity.
PCB Assembly Manufacturing Procedures:
vProgram Management
PCB Files →DCC →Program Organizing →Optimization →Checking
vSMT Management
PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping
vPCBA Management
THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
PCB Assembly Capability
Quantity | Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000 |
Type of Assembly | SMT,Thru-hole, DIP |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
Components | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
Bare Board Size | Smallest:0.25*0.25 inches Largest:20*20 inches |
File Formate | Bill of Materials Gerber files Pick-N-Place file |
Types of Service | Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test,X-ray Inspection AOI Test |