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4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics
4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics
Specifications
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Payment Terms :
T/T,Western union
Supply Ability :
1, 000, 000 PCS / week
Delivery Time :
5-10 days
Packaging Details :
inner: vacuum-packed bubble bag outer: carton box
Material :
FR4
Layer :
4
Color :
Green
Min line space :
4mil
Min line width :
4mil
Copper thickness :
1OZ
Board size :
275*60MM
Panel :
1
Surface :
Immersion Gold
Description

4 Layer Panel FR4 PCB Inverter PCB Design
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )

XCE PCB technical specification
Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance T≥0.8mm±8%,T＜0.8mm±5%
Wall hole copper thickness ＞0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance ＞1012Ωnormal
Through-hole resistance ＜300Ωnormal
Electric strength ＞1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity ＞6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


Parameter:

Product name FR4 PCB Double side 4 layer 6 layer 8 layer 10-28layer
layer Single side Double side 4 layer 6 layer 8 layer 10-28layer
Base Maerial FR4 FR4,Alu,polymide FR4 FR4 FR4 FR4
Copper thickness 1-6OZ
Min.Hole size 0.1mm
Min.Line Width 0.1mm
Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder masker color green,red,black,white,yellow
Silkscreen color black,white,yellow
Tolerance - Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Special requirements Buried and blind vias+controlled impedance +BGA

Rigid PCB Manufacturing Capabilities
Total Pad Size Standard Advanced
Capture Pad Drill + 0.008 Drill + 0.006
Landing Pad Drill + 0.008 Drill + 0.006
BC Mechanical Drill (Type III) 0.008 0.006
Laser Drill Size 0.004-0.010 0.0025
Material Thickness 0.0035 0.0025
Stacked Via Yes Yes
Type I Capabilities single & Double Deep Yes Yes
Type II Capabilities Buried Vias with Microvias Yes Yes
Type III Capabilities Yes Yes
Copper Filled Microvia Yes Yes
Smallest Copper Filled Microvia 0.004 0.0025
Copper Filled Microvia Aspect Ratio 0.75:1 1:01
Smallest Laser Microvia Hole Size 0.004 0.0025
Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:01

Layers 1-16 layers Min Board Thickness(2-layer) 0.2mm
Max Board Size 635 × 1100mm Min Board Thickness(4-layer) 0.6mm
Min Board Size 20 × 30mm Min Inner-layer Thickness 0.1mm
Min Trace 0.1mm Min Annular Ring 0.1mm
Min Space 0.1mm Min Hole Location Tolerance ±0.075mm
Min Hole Size 0.2mm Min Hole Size Tolerance ±0.05mm
Board Warp ≤ 1° Min Outer Dimension Tolerance ±0.1mm
Solder Mask Green, Yellow, Red, Black, Blue, White
Surface Finish HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material FR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic
Acceptable file Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD
CAM software Genesis, CAM350



Product tags

fr4 multilayer pcb

,

fr4 single layer pcb

,

multilayer pcb circuit board
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4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics

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Product Detail
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Contact Supplier
4 Layer Panel Design 1.6mm 2oz Fr4 PCB Multilayer PCB Board for Electronics

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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