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Multilayer Rigid PCB / Hiigh Density 8 Layer PCB PLC Power Circuit Board
Multilayer Rigid PCB / Hiigh Density 8 Layer PCB PLC Power Circuit Board
Specifications
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Payment Terms :
T/T,Western union
Supply Ability :
1, 000, 000 PCS / week
Delivery Time :
5-10 days
Packaging Details :
inner: vacuum-packed bubble bag outer: carton box
Material :
FR4
Layer :
4
Color :
Black
Min line space :
4mil
Min line width :
4mil
Copper thickness :
1OZ
Board size :
80*80mm
Panel :
1
Surface :
ENIG
Description

Multilayer Rigid PCB/ Hiigh-Density 8-Layer PCB PLC Power Circuit Board

Quick detail:

Origin:China Special: FR4 Material
Layer:8 Thickness:1.6mm
Surface: ENIG Hole:0.5

Specification:

Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen,

FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.

BGA's full name Ball Grid Array (solder ball array package), which is in the bottom of the package substrate array solder ball as the circuit I / O terminals and printed circuit board (PCB) interconnection. The device using this technology is a surface mount device package.

PBG (Plastic Ball Grid Array), which uses BT resin / glass laminate as the substrate, plastic (epoxy molding compound) as the sealing material, solder ball can be divided into lead solder (63Sn37Pb, 62Sn36Pb2Ag) and lead-free solder Sn96.5Ag3Cu0.5), solder ball and package connections do not require additional use of solder.

Parameter:

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size: (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance: ±0.13
13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

1 Layers Single Sided,2 to 18 Layer
2 Board material type FR4,Rogers,Taconic,F4B,Isola,Nelco and more
3 Compound material lamination 4 to 6 layers
4 Maximum dimension 610 x 1,100mm
5 Dimension tolerance ±0.13mm
6 Board thickness coverage 0.2 to 6.00mm
7 Board thickness tolerance Board thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%
8 DK thickness 0.076 to 6.00mm
9 Minimum line width 0.10mm
10 Minimum line space 0.10mm
11 Outer layer copper thickness 8.75 to 175µm
12 Inner layer copper thickness 17.5 to 175µm
13 Drilling hole diameter (mechanical drill) 0.25 to 6.00mm
14 Finished hole diameter (mechanical drill) 0.20 to 6.00mm
15 Hole diameter tolerance (mechanical drill) 0.05mm
16 Hole position tolerance (mechanical drill) 0.075mm
17 Laser drill hole size 0.10mm
18 Board thickness and hole diameter ratio 10:01
19 Solder mask type Green, Yellow, Black, Purple, Blue, White and Red
20 Minimum solder mask Ø0.10mm
21 Minimum size of solder mask separation ring 0.05mm
22 Solder mask oil plug hole diameter 0.25 to 0.60mm
23 Impedance control tolerance ±10%
24 Surface finish Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger
25 Certificate ROHS, ISO9001:2008, SGS, UL certificate
26 Acceptable file format Gerber file,PROTEL series,PADS series,POWER PCB series,AutoCAD
Product tags

multilayer pcb circuit board

,

standard 4 layer pcb stackup

,

four layer rigid pcb
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Multilayer Rigid PCB / Hiigh Density 8 Layer PCB PLC Power Circuit Board

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Product Detail
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Contact Supplier
Multilayer Rigid PCB / Hiigh Density 8 Layer PCB PLC Power Circuit Board

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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