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RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask
RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask
Specifications
Brand Name :
XCE
Model Number :
XCE Bh788
Certification :
CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
MOQ 1 Piece
Price :
Negotiation
Payment Terms :
T/T, Western Union
Supply Ability :
1000000 pieces per week
Delivery Time :
5-10 working days
Packaging Details :
1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color :
Green
Material :
FR4
Layer :
4
Board Size :
7*6cm
Copper Thinknes :
1 oz
Min Line Width :
4 mil
Min Line Space :
4mil
Surface Finish :
Immersion Tin
Name :
FR4 PCB
Description

RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask

Quick Detail :
1. Type : Pcb
2. Material : FR4
3. Layer : Multilayer
4. Products Size: 7*6cm
5. Permittivity : 2.5
6. Surface finish : Immersion Tin

Description :

1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,Cooper Base,high frequency material,Rogers,Taconic,Isola,F4B,Arlon

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

4.RT/duroid high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.

Data :

Layer 1 to 28 layers
Material type FR-4,Rogers,Taconic,Isola,F4B
Board thickness 0.21mm to 7.0mm
Copper thickness 0.5 OZ to 7.0 OZ
Copper thickness in hole >25.0 um (>1mil)

Size

 Max. Board Size: 23 × 25 (580mm×900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)

Surface finishing

 HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

Tolerance

 Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate UL, ISO 9001, ISO 14001
Special requirements Buried and blind vias+controlled impedance +BGA
Profiling Punching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

Production Description :

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane 0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s


Total Pad Size Standard Advanced
Capture Pad Drill + 0.008 Drill + 0.006
Landing Pad Drill + 0.008 Drill + 0.006
BC Mechanical Drill (Type III) 0.008 0.006
Laser Drill Size 0.004-0.010 0.0025
Material Thickness 0.0035 0.0025
Stacked Via Yes Yes
Type I Capabilities single & Double Deep Yes Yes
Type II Capabilities Buried Vias with Microvias Yes Yes
Type III Capabilities Yes Yes
Copper Filled Microvia Yes Yes
Smallest Copper Filled Microvia 0.004 0.0025
Copper Filled Microvia Aspect Ratio 0.75:1 1:01
Smallest Laser Microvia Hole Size 0.004 0.0025
Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 c


Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Product tags

solder mask pcb

,

pcb solder mask

,

diy pcb solder mask
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RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask

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Product Detail
Brand Name :
XCE
Model Number :
XCE Bh788
Certification :
CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
MOQ 1 Piece
Price :
Negotiation
Contact Supplier
RoHS Double Copper Multilayer Custom PCB Boards With Green Solder Mask

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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