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Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process
Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process
Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process
Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process
Specifications
Brand Name :
XCE
Model Number :
XCER-1
Certification :
CE,ROHS, FCC,ISO9008
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Payment Terms :
T/T,Western union
Supply Ability :
1, 000, 000 PCS / week
Delivery Time :
5-10 days
Packaging Details :
inner: vacuum-packed bubble bag  outer: carton box
Copper THK :
1OZ
Board size :
20*10cm
Board THK :
0.2mm
Surface finish :
Gold plating
Description

Rogers PCB For 3G / 4G LTE Mobile Base Station Antenna Equipment

Specification:

Brand: XCE
Number of layer: 2
Surface finish: Gold plating
Board size: 10*20cm
Board thickness: 0.2mm
Cu thickness: 1OZ
Base material: Rogers4350B
Origin: Shenzhen

Knowledge:

What's difference between immersion gold and gold plating?

Gold plating: Hard gold, electronic gold

Immersion gold: Soft gold, ENIG

Gold plating: using the way of electroless plating, the gold particles are attached to the pcb board, because strong adhesion, also known as hard gold, memory of the finger as hard gold, generally bound pcb also using gold plating.
Immersion gold: through a chemical reaction, crystallization gold particles attached to the pcb pad, because of weak adhesion, also known as soft gold

Parameter

Board thickness tolerance

T≥0.8mm±8%,T＜0.8mm±5%

Wall hole copper thickness

＞0.025mm(1mil)

Finished hole

0.2mm-6.3mm

Min line width

4mil/4mil(0.1/0.1mm)

Min bonding pad space

10mil

PTH aperture tolerance

10mil

NPTH aperture tolerance

10mil

Hole site deviation

10mil

Profile tolerance

±0.10mm

Board bend&warp

≤0.7%

Insulation resistance

＞1012Ωnormal

Through-hole resistance

＜300Ωnormal

Electric strength

＞1.3kv/mm

Current breakdown

10A

Peel strength

1.4N/mm

Soldmask regidity

＞6H

Thermal stress

288℃20Sec

Testing voltage

50-300v

Min buried blind via

N/O

Outer cooper thickness

3oz

Inner cooper thickness

3oz

Aspect ratio

8:1

SMT min green oil width

0.08mm

Min green oil open window

0.05mm

Insulation layer thickness

0.075mm-5mm

Aperture

0.2mm-0.6mm

Advantage:

Sufficient rogers material raw,promopt response and delivery time.

24 hours online quotation service

Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process

Product tags

printed circuit board fabrication

,

printed circuit board fabrication process

,

printed circuit board manufacturing
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Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process

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Product Detail
Brand Name :
XCE
Model Number :
XCER-1
Certification :
CE,ROHS, FCC,ISO9008
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Contact Supplier
Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process
Gold Plating Rogers 0.2MM Board Thickness Custom Printed Circuit Board Manufacturing Process

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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