Printed Circuit Board Multilayer PCB FR4 Material Custom-Made Service
Specification:
Model: XCEM
Origin: China
Min line space: 10mil
Min line width: 10 mil
Board size: 16*6 cm
Layer: 8
Board thickness: 1.2mm
Copper foil: 35UM
Material: FR4
Our Quality:
We are committed to providing the HIGHEST QUALITY PCBs that not only meet but exceed our customers’ expectations and requirements. Our facilities hold a list of quality certifications (IS9001, TS16949, UL) and the systems to support them. For quality control purposes, we have invested extensively in inspection machinery, including:
High-voltage E-test
Flying probe machine
Digital computer metallographic microscope
Copper thickness tester
Solderability detecting machine
Photoelectricity balance
X-ray gold thickness tester
Backlighting tester
Automatic optical inspector
Parameter:
Technology | Capabilities | Capabilities |
Max.Layer Count | 30 Layers | 30 Layers |
Max.Panel Size | 27.5"x24" | 27.5"x24" |
Max.Board Thickness | 3.5mm | 5.8mm |
Outer Layer | 3.5/3.5mils | 3/3mils |
Inner Layer | 3.5/3.5mils | 3/3mils |
Min.Board Thickness | 2L:6mils | 2L:6mils |
| 4L:15mils | 4L:15mils |
| 6L:23mils | 6L:23mils |
Min.SMT/BGA Pitch | 12mils for SMT | 12mils for SMT |
| 24mils for BGA | 20mils for BGA |
Min.Drill Size&Aspect Ratio | 0.2mm Drill for 0.8mm Thickness(4.0:1) | 0.2mm Drill for 0.8mm |
| 0.25mm Drill for 1.6mm | 0.25mm Drill for 1.6mm |
| 0.30mm Drill for 2.4mm | 0.30mm Drill for 2.4mm |
Surface Finishes | HASL | HASL |
| Selective Immersion Tin | Selective Immersion Tin |
| Immersion Silver | Immersion Silver |
| Immersion Gold | Immersion Gold |
| Hard Gold | Hard Gold |
| OSP | OSP |
| Gold finger | Gold finger |
Controlled Impedance | +/- 10% | +/-7% |
Contouring | Routing, V-Groove, | Routing, V-Groove, |
| Beveling Punch | Beveling Punch |
Hole Diameter | +/- 2 mil | +/- 2 mil |
Min.S/M Thickness | 0.4 mil | 0.6 mil |