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High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper
High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper
High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper
High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper
Specifications
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Payment Terms :
T/T,Western union
Supply Ability :
1, 000, 000 PCS / week
Delivery Time :
5-10 days
Packaging Details :
inner: vacuum-packed bubble bag  outer: carton box
Min line space :
0.2mm
Min line width :
0.2mm
Copper thickness :
2OZ
Size :
8*4cm
Board THK :
1.0MM
Panel :
3*2
Surface finish :
HAL Lead free
Color :
green
Description

Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards

Quick Detail:

Material: FR4

Number of layer: 4

Model: XCEF

Brand: XCE

Name: FR4 PCB

Origin: China

Parameter:

XCE PCB technical specification
Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance　　 T≥0.8mm±8%,T＜0.8mm±5%
Wall hole copper thickness　　 ＞0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance ＞1012Ωnormal
Through-hole resistance ＜300Ωnormal
Electric strength ＞1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity ＞6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating
Product tags

thermal conductivity of fr4 pcb

,

fr4 pcb thermal conductivity

,

high thermal conductivity pcb
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High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper

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Product Detail
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Contact Supplier
High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper
High Thermal Conductivity FR4 Multilayer PCB Printed Circuit Boards with 2OZ Copper

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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