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FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material
FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material
Specifications
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Payment Terms :
T/T,Western union
Supply Ability :
1, 000, 000 PCS / week
Delivery Time :
5-10 days
Packaging Details :
inner: vacuum-packed bubble bag  outer: carton box
Min line space :
3mil
Min line width :
3mil
Copper thickness :
1OZ
Size :
8*4cm
Board THK :
1.0MM
Panel :
2*1
Surface finish :
immersion gold
Model :
XCEM
Brand :
XCE
Material raw :
Rogers
Color :
Green
Layer :
1
Description

FR4 PCB Multilayer Boards ENIG High Frequency High Level Bonding Material

Quotation Requirement :

Following specifications are needed for quotation:

a) Base material

b) Board thickness

c) Copper thickness

d) Surface treatment

e) color of solder mask and silkscreen

f) Quantity

Parameter:

Max panel size 508*610mm
Board thickness tolerance T≥0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300V
Min buried blind via 0.2mm(8mil)
Outer copper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickless 0.075mm-5mm
Taphole aperture 0.2mm-0.6mm
Special technology Indepedance,Blind buried via,thick gold,aluminum PCB
Surface finish HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

Delivery Time for PCB board:

1) PCB production time: sample: 3-4 days / mass production: within 7 days

2) Component purchase: 2 days if all components is available in our domestic market.

3) PCB Assembly: samples: whthin 2 days / mass production: within 5 days

Shipping Method and Payment terms:

1. By DHL, UPS, FedEx, TNT using clients account.

2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.

3. By EMS (Usually for Russia Clients), price is high.

4. By sea for mass quantity according to customer's requirement.

5. By customer's Forwarder

6.By Paypal,T/T,West Union,etc.

Testing Procedures For PCB Board:

We perform multiple quality assuring procedures before shipping out any PCB board.

These include:

* Visual Inspection

* Flying probe

* Impedance control

* Solder-ability detection

* Digital metallograghic microscope

* AOI (Automated Optical Inspection)

FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material

Product tags

lead free pcb multilayer pcb

,

fr4 single layer pcb

,

double-layer pcb
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FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material

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Product Detail
Brand Name :
XCE
Model Number :
XCEM
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Contact Supplier
FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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