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HDI Double Sided Printed Circuit Boards Rogers ENIG High Density Interconnect PCB Boards
HDI Double Sided Printed Circuit Boards Rogers ENIG High Density Interconnect PCB Boards
HDI Double Sided Printed Circuit Boards Rogers ENIG High Density Interconnect PCB Boards
HDI Double Sided Printed Circuit Boards Rogers ENIG High Density Interconnect PCB Boards
Specifications
Brand Name :
XCE
Model Number :
XCED
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Payment Terms :
T/T,Western union
Supply Ability :
1, 000, 000 PCS / week
Delivery Time :
5-10 days
Packaging Details :
inner: vacuum-packed bubble bag outer: carton box
Material :
Rogers
Layer :
2
Color :
white
Min line space :
8mil
Min line width :
8mil
Copper thickness :
2OZ
Size :
12*9 cm
Board THK :
1.6MM
Panel :
5*2
Surface finish :
Immersion gold
Model :
XCED
Brand :
XCE
Description

HDI Double Sided Printed Circuit Boards Rogers ENIG High Density Interconnect PCB Boards

Description

  • Single, Double Sided & Multilayer PTFE PCB’s
  • Precision pocket machining
  • Heat Sink Technology
  • Thin dielectric films
  • Any type of wire bondable finishes
  • In-house plating and precision machining for finished assemblies
  • Aluminum Composites: American Standard Circuits makes PCBs with unique aluminum composite materials to match the coefficient of thermal expansion (CTE) for various heat generating devices. These materials can match the CTE of ceramics, transistor packages and PCBs. This gives greater flexibility in designs to use lightweight materials and meet challenging environmental requirements.
  • Pre-bonded and post-bonded materials
  • Metals include Aluminum, Copper, Brass, Aluminum Composites
  • Thermally and electrically conductive and non-conductive proprietary and commercially available adhesive bonded laminates
  • Plated through hole capability metal carrier to PTFE

Parameter:

Layer

1 to 28 layers

Material type

FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

Board thickness

0.21mm to 7.0mm

Copper thickness

0.5 OZ to 7.0 OZ

Copper thickness in hole

>25.0 um (>1mil)

Size

Max. Board Size: 23 × 25 (580mm×900mm)

Min. Drilled Hole Size: 3mil (0.075mm)

Min. Line Width: 3mil (0.075mm)

Min. Line Spacing: 3mil (0.075mm)

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

Tolerance

Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076 NPTH: ±0.05

Certificate

UL, ISO 9001, ISO 14001

Special requirements

Buried and blind vias+controlled impedance +BGA

Profiling

Punching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

Product tags

hdi printed circuit boards

,

pcb support

,

hdi printed circuit board
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HDI Double Sided Printed Circuit Boards Rogers ENIG High Density Interconnect PCB Boards

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Product Detail
Brand Name :
XCE
Model Number :
XCED
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Contact Supplier
HDI Double Sided Printed Circuit Boards Rogers ENIG High Density Interconnect PCB Boards
HDI Double Sided Printed Circuit Boards Rogers ENIG High Density Interconnect PCB Boards

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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