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Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control
Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control
Specifications
Brand Name :
XCE
Model Number :
XCER
Certification :
CE,ROHS, FCC,ISO9008
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Payment Terms :
T/T,Western union
Supply Ability :
1, 000, 000 PCS / week
Delivery Time :
5-10 days
Packaging Details :
inner: vacuum-packed bubble bag  outer: carton box
Base material :
KB fr4
Name :
FR4 high speed pcb
Board thickness :
20mil
Copper THK :
1OZ
Board size :
6*3cm
Surface finish :
Immersion gold
Description

Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control


Specification

PCB Type:

FR4 PCB

Layer :

4 layer

Min .Line Width/Space:

8milmil/8mil

Min. Via Diameter:

0.3mm

Finish Thickness:

20mil

Surface Finish:

ENIG

Size:

3*6MM

Material:

KB FR4

Color:

green

Application:

aviation




High frequency PCB Introduce:

ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO58800.254 0.508 0.7622.20 ± 0.02
RO43500.254 0.508,0.8,1.5243.5
RO40030.5083.38
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2



Parameter

Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance＞1012Ωnormal
Through-hole resistance＜300Ωnormal
Electric strength＞1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity＞6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating



Description:

FR4 Multi-Layer PCB refer to printed circuit board has more than two copper layers, such as 4L, 6L, 8L, 10L, 12L, etc. As technology improving, people can put more and more copper layers on the same board. Currently, we can produce 20L-32L FR4 PCB.
By this structure, engineer can put trace on different layers for different purpose, such as layers for power, for signal transfering, for EMI shielding, for components assembly, and so on. In order to avoid too many layers, Buried Via or Blind via will be designed in multi-layer PCB. For board more than 8 layers, high Tg FR4 material will be popular than normal Tg FR4.
More layers it is, more complex & difficult the manufacturing will be, and more expensive the cost will be. The lead time of multi-layer PCB is different from normal one, please contact us for accurate leading time.























Product tags

multilayer hdi pcb

,

hdi multilayer pcb

,

high speed pcb design
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Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control

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Product Detail
Brand Name :
XCE
Model Number :
XCER
Certification :
CE,ROHS, FCC,ISO9008
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Contact Supplier
Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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