Specifications
Brand Name :
XCE
Model Number :
XCEF
Certification :
CE,FCC,Rohs,ISO9001,SGS,UL
Place of Origin :
China
MOQ :
1PCS
Price :
USD 1-500
Payment Terms :
Western Union, L/C, T/T
Supply Ability :
10000000pcs / per month
Packaging Details :
inner vacuum package, outer carton box
Color :
Green
Layer :
2
Board size :
9*6cm
Board THK :
1.0mm
Cu THK :
35UM
Panel Size :
3*3
Description

Multilayer High TG180 Fr4 PCB Printed Circuit Boards Maker For High - tech Industries

Specification:

Base Material: Fr4 TG180
Layer:2
Thickness: 1.0MM
Copper weight:1OZ
Surface finish: Immersion gold

Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.

Parameter:

Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
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Multilayer High TG180 Fr4 PCB Printed Circuit Boards Maker For High - tech Industries

Ask Latest Price
Brand Name :
XCE
Model Number :
XCEF
Certification :
CE,FCC,Rohs,ISO9001,SGS,UL
Place of Origin :
China
MOQ :
1PCS
Price :
USD 1-500
Contact Supplier
Multilayer High TG180 Fr4 PCB Printed Circuit Boards Maker For High - tech Industries

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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