6 Layer Multilayer WIFI Printed Circuit Board For Audio Transmitter​

Features:

>Glass-reinforced hydrocarbon and ceramic dielectric

>Excellent high frequency performance due to low dielectric tolerance and loss

>Stable electrical properties versus frequency

>Low Z-axis expansion and excellent dimensional stability

Specification:

Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.

Applications:

High frequency high frequency wireless communication

High speed computer

Satellite signal transmission equipment

Microstrip and cellular base station

Antennas and power amplifiers

LNA/LNB

Parameter: