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Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With Impedance Control
Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With Impedance Control
Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With Impedance Control
Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With Impedance Control
Specifications
Brand Name :
XCEPCB
Model Number :
XCEPCBR
Certification :
CE,FCC,ISO9008,SGS,UL
Place of Origin :
CHINA
MOQ :
1pcs
Price :
USD 0.1-10
Payment Terms :
Western Union,, T/T
Supply Ability :
1000000PCS/per week
Delivery Time :
3-12 days
Packaging Details :
Inner:Vacuum packed bubble bag Outer:Carton box / mentioned is standard packing method,unless otherwise specified.
Size :
12*8cm
Surface :
ENIG
Board THK :
1.2mm
Copper THK :
2OZ outer
Layer :
4
Core :
1pcs
Panel :
2*1
Delivery time :
3-7days
Material :
FR4 KB series
Color :
green
Description

Mini Pad 4 Layer Multilayer PCB Circuit Board With Impedance Control

Key Specifications/Special Features:

  • Surface treatment: ENIG, OSP, ENIG+OSP, immersion tin, immersion silver, carbon oil, HASL
  • 2mil min width/space
  • Main base material: KB SHENGYI FR4
  • Copper thickness: 1/3oz-0.5oz
  • Min finished board thickness: 0.4mm
  • Min hole size: pth 8mil
  • Aspect ratio: 12:1
  • PTH dia. tolerance: +/-3mil(+/-0.075mm)
  • NPTH dia. tolerance: +/-2mil(+/-0.05mm)
  • Impedance control: +/-10%
  • Back-drilling: Yes
  • Profile: CNC, punch
  • Testing: fly probe, E-test
  • Equipment: LDI exposure machine, AOI Inspection, large-scale laminating machine, laser drilling machine, horizontal PTH, automatic exposure machine, DES line, automatic CNC, automatic tester, automatic visual inspection, vertical circular electroplating machine, automatic immersion gold machine, drilling machine, high-speed flying probe tester

Parameter:

First of All: Check the MainTechnic Parameters:

1 Layer 1-30 layer
2 Material FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum
3 Board thickness 0.2mm-7mm
4 Max.finished board side 500mm*500mm
5 Min.drilled hole 0.25mm
6 Min.line width 0.075mm(3mil)
7 Min.line spacing 0.075mm(3mil)
8 Soldering Cover Color red/blue/yellow black/white/ green
9 Hole tolerance PTH:±0.076,NTPH:±0.05
10 Copper thickness 0.5-4.0oz
11 Surface treatment HASLOSPENIGENIS
12 Profiling Punching V-CUT / Routering

Application


Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries

Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With Impedance Control

Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With Impedance Control








Product tags

pcb board for fabrication

,

ipc standard for pcb assembly

,

fabrication single side pcb
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Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With Impedance Control

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Product Detail
Brand Name :
XCEPCB
Model Number :
XCEPCBR
Certification :
CE,FCC,ISO9008,SGS,UL
Place of Origin :
CHINA
MOQ :
1pcs
Price :
USD 0.1-10
Contact Supplier
Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With Impedance Control
Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With Impedance Control

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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