Specifications
Brand Name :
XCE
Model Number :
XCED
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Payment Terms :
T/T,Western union
Supply Ability :
1, 000, 000 PCS / week
Delivery Time :
5-10 days
Packaging Details :
inner: vacuum-packed bubble bag outer: carton box
Copper thickness :
70um
Size :
18*6cm
Board THK :
1.0MM
Panel :
3*2
Surface finish :
Immersion gold
Color :
green
Min line space :
5mil
Min line width :
5mil
Description

HDI Multilayer PCB High Density Universal Board 10 Layers with Blind / Burried Vias

Description

1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

Quick Detail:

Material: FR4 Number of layer: 10
Model: XCEM Brand: XCE
Name: Multilayer PCB Origin: shenzhen

Parameter:

Board thickness

0.21mm to 7.0mm

Copper thickness

0.5 OZ to 7.0 OZ

Copper thickness in hole

>25.0 um (>1mil)

Size

Max. Board Size: 23 × 25 (580mm×900mm)

Min. Drilled Hole Size: 3mil (0.075mm)

Min. Line Width: 3mil (0.075mm)

Min. Line Spacing: 3mil (0.075mm)

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

Tolerance

Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076 NPTH: ±0.05

Certificate

UL, ISO 9001, ISO 14001

Special requirements

Buried and blind vias+controlled impedance +BGA

Profiling

Punching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

Advantages:

1) We have professional research team.

2) No MOQ,small order are aslo welcome,From Prototype to Mass production.

3) All products are 100% tested working before sent to you.

4) One stop PCB solution

5) We have professional sales team, so please do not hesitate to contact us if you have any question

Xinchenger Electronics co.,Ltd established in 2009,we have commited ourselves to manufacturing various of hi-frequency microwave pcb and multi-layer board including fastest sample production.

we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality.furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.

HDI Multilayer 10 Layer PCB High Density Circuit Board With Blind / Burried Vias

HDI Multilayer 10 Layer PCB High Density Circuit Board With Blind / Burried Vias

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HDI Multilayer 10 Layer PCB High Density Circuit Board With Blind / Burried Vias

Ask Latest Price
Brand Name :
XCE
Model Number :
XCED
Certification :
CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
1pcs
Price :
negotiation
Contact Supplier
HDI Multilayer 10 Layer PCB High Density Circuit Board With Blind / Burried Vias
HDI Multilayer 10 Layer PCB High Density Circuit Board With Blind / Burried Vias

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
Contact Supplier
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