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Multilayer Fr4 PCB High TG With Gold Plating Surface Finish
Multilayer Fr4 PCB High TG With Gold Plating Surface Finish
Multilayer Fr4 PCB High TG With Gold Plating Surface Finish
Multilayer Fr4 PCB High TG With Gold Plating Surface Finish
Specifications
Brand Name :
XCE
Model Number :
XCE BG520
Certification :
CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
MOQ 1 Piece
Price :
Negotiation
Payment Terms :
T/T, Western Union
Supply Ability :
1000000 pieces per week
Delivery Time :
5-10 working days
Packaging Details :
1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color :
Yellow
Material :
Fr4 Material
Layer :
Multilayer
Board Size :
12*6cm
Copper Thinknes :
1 oz
Min Line Width :
5 mil
Min Line Space :
5 mil
Surface Finish :
Immersion Silver
Name :
FR4 pcb
Description

Multilayer Fr4 PCB High TG With Gold Plating Surface Finish
Quick Detail :
1. Type : Pcb
2. Material : Fr4
3. Layer : Multilayer
4. Products Size :12*6cm
5. Permittivity : 3
6. Surface finish : Gold Plating

Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 3 dielectric conductivity much more precision .


Description :
Most printed circuit boards are manufactured using glass-reinforced epoxy laminate as the substrate. While there are a wide variety of laminates available on the market, FR-4 is both versatile and well-accepted as a standard material for PCB manufacture. FR-4 functions well as an electrical insulator, and has a good strength-to-weight ratio, and is flame resistant.
The standard FR-4 material that is used in our PCBExpress® Quickturn, ValueProto® and the default material for our PCBpro® Full Feature products is a high temperature, high Td, low CTE 150Tg material.
If a higher Tg material is required, we do stock a 170Tg version of our standard FR-4 material as well, that can be substituted in our PCBpro Full Feature and Custom Quote products (provide a readme file or a print note specifying the 170 Tg material). There may be a material lead time for some specific sizes or thickness, and may impact due date.

Key Benefits:

  • High dielectric constant for circuit size reduction
  • Low loss. Ideal for operating at X-band or below
  • Tight εr and thickness control for repeatable circuit performance

Typical Applications:

  • Space Saving Circuitry
  • Patch Antennas
  • Satellite Communications Systems
  • Power Amplifiers
  • Aircraft Collision Avoidance Systems
  • Ground Radar Warning Systems

Production Description :

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane 0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s



Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.




Product tags

pcb gold plating thickness

,

multilayer ceramic pcb

,

ceramic multilayer pcb
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Multilayer Fr4 PCB High TG With Gold Plating Surface Finish

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Product Detail
Brand Name :
XCE
Model Number :
XCE BG520
Certification :
CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin :
China
MOQ :
MOQ 1 Piece
Price :
Negotiation
Contact Supplier
Multilayer Fr4 PCB High TG With Gold Plating Surface Finish
Multilayer Fr4 PCB High TG With Gold Plating Surface Finish

Shenzhen Xinchenger Electronic Co.,Ltd

Site Member
10 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Fr4 PCB, High Frequency PCB
Total Annual :
1000000-2000000
Employee Number :
100~200
Certification Level :
Site Member
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