4512 1245 Wireless Base Station Silver Plated Brass Large Current Fast Slow Acting Ceramic SMD Fuses Surface Mount Fuse
EBF Fast Acting SMD Fuses
SCOPE | ||||||||||||||||||||
Notebook PC | LCD/PDF TV | LCD/PDP panel | LCD monitor0 | |||||||||||||||||
LCD backlight inverter | Portable DVE player | Power supply | Networking | |||||||||||||||||
PC server | Cooling fan system | Storage system | Telecom system | |||||||||||||||||
Wireless base station | White goods | Game console | Automotive | |||||||||||||||||
Battery charging circuit | Office Automation | Industrial equipment | Medical equipment |
Structure
NO. | Component | Material | Quantity | ||||||||||||||||
① | Cap | Silver Plated Brass | 2 | ||||||||||||||||
② | Body | Ceramic tube | 1 |
PRODUCT CHARACTERISTICS
No. | Item | Contain | Reference standard | ||||||||||||||||
1 | Insulation Resistance | 10,000 ohms minimum | MIL-STD-202G, Method 302 Test ConditionA | ||||||||||||||||
2 | Solderability | T=235℃±5 ℃, t=5+0/-0.5s, Cover≧95% | MIL-STD-202G, Method 208H | ||||||||||||||||
3 | Resistance to Soldering Heat | 10 sec at 260℃ | MIL-STD-202G, Method 210F Test Condition B | ||||||||||||||||
4 | Thermal Shock | 5 cycles, -65℃ to 125℃, 15minutes @each extreme | MIL-STD-202G, Method 107G Test Condition B | ||||||||||||||||
5 | Mechanical Shock | 100G’s peak for 6 milliseconds, 3 cycles | MIL-STD-202G, Method 213B Test 1 | ||||||||||||||||
6 | Vibration | 0.03” amplitude, 10-55 Hz in 1 min. 2hrs each XYZ=6hrs | MIL-STD-202G, Method 201A | ||||||||||||||||
7 | Moisture Resistance | 10 cycles | MIL-STD-202G, Method 106G | ||||||||||||||||
8 | Salt spray | 48hrs | MIL-STD-202G, Method 101E Test Condition B |
Pre-Arcing Time / Current Characteristics
Ampere Rating | % of Ampere Rating | Opening Time | |||||||||||||
5A – 50A | 125% | 1 hours, Min . | |||||||||||||
200% | 2min, Max . | ||||||||||||||
1000% | 0.001 sec., Min.; 0.01 sec., Max. |
Reflow Condition | Pb-Free assembly | ||||||||||||
Preheating | -Temperature Min Ts(min) | 150℃ | |||||||||||
-Temperature Max Ts(man) | 200℃ | ||||||||||||
-Time Max | 120 secs | ||||||||||||
Soldering | -Temperature (TL)(Liquidus) | 260℃ | |||||||||||
-Time Max (TL) | 60 secs | ||||||||||||
-Temperature (TP) | Max 260℃ | ||||||||||||
-Time Max (TP) | 10 secs |
EBT Time Delay SMD Fuses
Scope | ||||||||||||||||
Notebook PC | LCD/PDF TV | LCD/PDP panel | LCD monitor | |||||||||||||
LCD backlight inverter | Portable DVE player | Power supply | Networking | |||||||||||||
PC server | Cooling fan system | Storage system | Telecom system | |||||||||||||
Wireless base station | White goods | Game console | Automotive | |||||||||||||
Battery charging circuit | Office Automation | Industrial equipment | Medical equipment |
Structure
NO. | Component | Material | Quantity | ||||||||||||
① | Cap | Silver Plated Brass | 2 | ||||||||||||
② | Body | Ceramic tube | 1 |
PRODUCT CHARACTERISTICS
No. | Item | Contain | Reference standard | ||||||||||||
1 | Insulation Resistance | 10,000 ohms minimum | MIL-STD-202G, Method 302 Test ConditionA | ||||||||||||
2 | Solderability | T=235℃±5℃, t=5+0/-0.5s, Cover≧95% | MIL-STD-202G, Method 208H | ||||||||||||
3 | Resistance to Soldering Heat | 10 sec at 260℃ | MIL-STD-202G, Method 210F Test Condition B | ||||||||||||
4 | Thermal Shock | 5 cycles, -65℃ to 125℃, 15minutes @each extreme | MIL-STD-202G, Method 107G Test Condition B | ||||||||||||
5 | Mechanical Shock | 100G’s peak for 6 milliseconds, 3 cycles | MIL-STD-202G, Method 213B Test 1 | ||||||||||||
6 | Vibration | 0.03” amplitude, 10-55 Hz in 1 min. 2hrs each XYZ=6hrs | MIL-STD-202G, Method 201A | ||||||||||||
7 | Moisture Resistance | 10 cycles | MIL-STD-202G, Method 106G | ||||||||||||
8 | Salt spray | 48hrs | MIL-STD-202G, Method 101E Test Condition B |
Pre-Arcing Time / Current Characteristics
Ampere Rating | % of Ampere Rating | Opening Time | |||||||||||
500mA – 40A | 125% | 1 hours, Min . | |||||||||||
200% | 2min, Max . | ||||||||||||
1000% | 0.001 sec., Min.; 0.01 sec., Max. |
Reflow Condition | Pb-Free assembly | |||||||||
Preheating | -Temperature Min Ts(min) | 150℃ | ||||||||
-Temperature Max Ts(man) | 200℃ | |||||||||
-Time Max | 120 secs | |||||||||
Soldering | -Temperature (TL)(Liquidus) | 260℃ | ||||||||
-Time Max (TL) | 60 secs | |||||||||
-Temperature (TP) | Max 260℃ | |||||||||
-Time Max (TP) | 10 secs |
Contact Details:
Andy Wu
Email: andy@tianrui-fuse.com.cn
MP/Whatsapp: +86 13532772961
Wechat: HFeng0805
Skype: andywutechrich
QQ: 969828363