2RA-5 Series Telecom Applications 75V-800V GDT Surge Protector Arrestor 5KA Gas Discharge Tube Arresters

Description

GDT is placed in front of, and in parallel with, sensitive telecom equipment such as power lines, communication lines, signal lines and data transmission lines to help protect them from damage caused by transient surge voltages that may result from lightning strikes and equipment switching operations. These devices do not influence the signal in normal operation.
However, in the event of an overvoltage surge, such as a lightning strike, the GDT switches to a low impedance state and diverts the energy away from the sensitive equipment.

Features

 Excellent response to fast rising transients

 Stable breakdown voltage

 GHz working frequency

 8/20μs Impulse current capability: 5KA

 Non-Radioactive

 Ultra Low capacitance (<1pF)

 Lead-free compliant

 RoHS and REACH compliant

 UL 497B Recognized: E465335

 Size: Ф5.5mm*6mm

 Storage and operational temperature: -40~+90°C

Applications

 CATV equipment

 Antennas

 RS 485

 Telecom Base Station

 Power Supply AC Main

 EV power Charging

 Inverter/Variable

 Frequency Drivers (VFDs)

 IEEE 802.3 compliant Ethernet interfaces

 Broad Band equipment

 xDSL, ADSL, ADSL2, VDSL, and VDSL2

 Medical Electronics

 Test Equipment

 General Telecom Equipment

 Renewable Energy

Part Number Code

Electrical Characteristics

1) At delivery AQL 0.65 level II, DIN ISO 2859

2) In ionized mode

3) Insulation Resistance Measuring Voltage:
75V at DC 25V
90V~150V at DC 50V
Other at DC 100V

Terms in accordance with ITU-T Rec. K.12, IEC 61643-311, GB/T 9043.

Packaging Quantity:

100 PCS per Plastic Tray

5 Plastic Trays per inner box 500 PCS per inner box

Axial Packaging (Tape & Reel)

Soldering Parameters - Wave soldering (Thru-Hole Devices)

Wave Soldering Condition

Pb-Free assembly

Preheat

Temperature Min

100°C

Temperature Max

150°C

Time (Min to Max)

60-180 Seconds

Solder Pot Temperature

280°C Max

Solder Dwell Time

2-5 Seconds

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Reflow Condition

Pb - Free assembly

Preheat

-Temperature Min (Ts(min))

150°C

-Temperature Max (Ts(max))

200°C

- Time (min to max) (ts)

60 -180 Seconds

Average ramp up rate ( Liquids Temp TL) to peak

3°C/second max

TS(max) to TL - Ramp-up Rate

5°C/second max

Reflow

- Temperature (TL) (Liquids)

217°C

- Time (min to max) (ts)

60 -150 Seconds

Peak Temperature (TP)

260 +0/-5°C

Time within 5°C of actual peak Temperature (tp)

10 - 30 Seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (TP)

8 minutes Max

Do not exceed

260°C