- High material purity: The purity of aluminum metal single crystal substrate can reach more than 99.99%, and the impurity content is very low, which can meet the demanding requirements of semiconductors for high-purity materials.

- Perfect crystallization: The aluminum single crystal substrate is grown by drawing method, which has a highly ordered single crystal structure, regular atomic arrangement, and few defects. This facilitates the subsequent precision machining and manufacturing on the substrate.

- High surface finish: The surface of the aluminum single crystal substrate is precision polished, and the roughness can reach the nanometer level, which meets the cleanliness standards of semiconductor manufacturing.

- Good electrical conductivity: As a metal material, aluminum has good electrical conductivity, which is conducive to the high-speed transmission of circuits on the substrate.

- Excellent processing performance: Aluminum single crystal substrates can be cut, polished, etched and other processes to create wafers of the required size and structure.

- Good thermal conductivity: Aluminum has excellent thermal conductivity, which is conducive to heat dissipation of devices on the substrate.

- Corrosion resistance: Aluminum substrates have a certain degree of chemical resistance and can meet the requirements of semiconductor production processes.

- Low cost: As a common metal material, aluminum has relatively low raw material and production costs, which is conducive to reducing wafer manufacturing costs.

Technical Parameters

1. Integrated circuit manufacturing: Aluminum substrates are one of the main substrates for manufacturing integrated circuit chips. Complex circuit layouts can be fabricated on wafers, which are used to produce various integrated circuit products such as CPUs, GPUs, and memories.

2. Power electronic devices: Aluminum substrates are suitable for manufacturing MOSFETs, power amplifiers, LEDs and other power electronic devices. Its good thermal conductivity is conducive to the heat dissipation of the device.

3. Solar cells: Aluminum substrates are widely used in the manufacture of solar cells, as electrode materials or interconnect substrates. Aluminum has good conductivity and low cost advantages.

4. Microelectromechanical systems (MEMS): Aluminum substrates can be used to manufacture various MEMS sensors and actuators, such as pressure sensors, accelerometers, micromirrors, etc.

5. Optoelectronic devices: Aluminum substrates have important applications in the manufacture of optoelectronic devices such as LEDs, laser diodes, and photodetectors.

6. Compound semiconductors: In addition to the use of silicon substrates, aluminum substrates are also used in the manufacture of compound semiconductor devices such as GaAs and InP.

7. Electromagnetic shielding: Aluminum is a good electromagnetic shielding material, and aluminum substrates can be used to manufacture electromagnetic shielding covers, shielding boxes and other products.

8. Electronic packaging: Aluminum substrates are widely used in semiconductor device packaging as substrates or lead frames.

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