Specifications
Brand Name :
ZMSH
Model Number :
4H-P SiC
Certification :
rohs
Place of Origin :
CHINA
MOQ :
10pc
Price :
by case
Payment Terms :
T/T
Supply Ability :
1000pc/month
Delivery Time :
in 30days
Packaging Details :
customzied plastic box
Size :
5*5mm/10*10mm
Surface Hardness :
HV0.3>2500
Density :
3.21 G/cm3
Thermal Expansion Coefficient :
4.5 X 10-6/K
Dielectric Constant :
9.7
Tensile Strength :
>400MPa
Breakdown Voltage :
5.5 MV/cm
Applications :
Electric vehicles, satellite communications
Description

Product Description:

Sic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power Electronics

4H-P silicon carbide (SiC) is an important semiconductor material commonly used in high-temperature, high-frequency, and high-power electronic devices. 4H-SiC is a type of its crystal structure that has a hexagonal lattice structure. The wide bandgap (approx. 3.26 eV) allows it to operate in high temperature and high voltage environments. High thermal conductivity (about 4.9 W/m ·· K), superior to silicon, can effectively guide and dissipate heat. P-type doped silicon carbide has a low resistivity and is suitable for the construction of PN junctions. With the development of electric vehicles and renewable energy technologies, the demand for 4H-P type silicon carbide is expected to continue to grow, driving related research and technological advancements.

Sic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power ElectronicsSic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power Electronics


Features:

· Type: 4H-SiC crystal has a hexagonal lattice structure and provides excellent electrical characteristics.

· Wide bandgap: approx. 3.26 eV for high temperature and high frequency applications.

· P-type doping: P-type conductivity is obtained by doping elements such as aluminum, increasing the pore conductor concentration.

· Resistivity: Low resistivity, suitable for high power devices.

· High thermal conductivity: approx. 4.9 W/m·K, effective heat dissipation, suitable for high power density applications.

· High temperature resistance: It can work stably in high temperature environment.

· High hardness: Very high mechanical strength and toughness for harsh conditions.

· High breakdown voltage: Able to withstand higher voltages and reduce device size.

· Low switching loss: Good switching characteristics in high-frequency operation to improve efficiency.

· Corrosion resistance: Good corrosion resistance to a wide range of chemicals.

· Wide range of applications: suitable for electric vehicles, inverters, high-power amplifiers and other fields.

Sic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power ElectronicsSic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power Electronics


Technical Parameters:

等级Grade

精选级(Z 级)

Zero MPD Production

Grade (Z Grade)

工业级(P 级)

Standard Production

Grade (P Grade)

测试级(D 级)

Dummy Grade (D Grade)

直径 Diameter 99.5 mm~100.0 mm
厚度 Thickness 350 μm ± 25 μm
晶片方向 Wafer Orientation Off axis: 2.0°-4.0°toward [112 0] ± 0.5° for 4H/6H-P, On axis:〈111〉± 0.5° for 3C-N
微管密度 ※ Micropipe Density 0 cm-2
电 阻 率 ※ Resistivity p-type 4H/6H-P ≤0.1 Ωꞏcm ≤0.3 Ωꞏcm
n-type 3C-N ≤0.8 mΩꞏcm ≤1 m Ωꞏcm

主定位边方向 primary

Flat Orientation

4H/6H-P

-

{1010} ± 5.0°

3C-N

-

{110} ± 5.0°

主定位边长度 Primary Flat Length 32.5 mm ± 2.0 mm
次定位边长度 Secondary Flat Length 18.0 mm ± 2.0 mm
次定位边方向 Secondary Flat Orientation Silicon face up: 90° CW. from Prime flat ± 5.0°
边缘去除 Edge Exclusion 3 mm 6 mm
局部厚度变化/总厚度变化/弯曲度/翘曲度 LTV/TTV/Bow /Warp ≤2.5 μm/≤5 μm/≤15 μm/≤30 μm ≤10 μm/≤15 μm/≤25 μm/≤40 μm
表面粗糙度 ※ Roughness Polish Ra≤1 nm
CMP Ra≤0.2 nm Ra≤0.5 nm
边缘裂纹(强光灯观测) Edge Cracks By High Intensity Light None Cumulative length ≤ 10 mm, single length≤2 mm
六方空洞(强光灯测) ※ Hex Plates By High Intensity Light Cumulative area ≤0.05% Cumulative area ≤0.1%
多型(强光灯观测) ※ Polytype Areas By High Intensity Light None Cumulative area≤3%
目测包裹物(日光灯观测) Visual Carbon Inclusions Cumulative area ≤0.05% Cumulative area ≤3%
硅面划痕(强光灯观测) # Silicon Surface Scratches By High Intensity Light None Cumulative length≤1×wafer diameter
崩边(强光灯观测) Edge Chips High By Intensity Light None permitted ≥0.2mm width and depth 5 allowed, ≤1 mm each
硅面污染物(强光灯观测) Silicon Surface Contamination By High Intensity None


Applications:

1. Power electronics
Power converters: For efficient power adapters and inverters for smaller size and higher energy efficiency.


Electric vehicles: Optimize power conversion efficiency in drive modules and charging stations for electric vehicles.

2. RF devices
Microwave amplifiers: Used in communication and radar systems to provide reliable high-frequency performance.


Satellite Communications: High-power amplifier for communication satellites.

3. High temperature applications
Sensor: A sensor used in extreme temperature environments, capable of stable operation.


Industrial equipment: equipment and instruments adapted to high temperature conditions.

4. Optoelectronics
LED technology: Used to improve luminous efficiency in specific short-wavelength LEDs.


Lasers: Efficient laser applications.

5. Power system
Smart Grid: Improving energy efficiency and stability in high-voltage direct current (HVDC) transmission and grid management.

6. Consumer Electronics
Fast charging device: A portable charger for electronic devices that improves charging efficiency.

7. Renewable energy
Solar inverter: Achieve higher energy conversion efficiency in photovoltaic systems.

Sic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power Electronics

Customization:

Our SiC substrate is available in the 4H-P type and is RoHS certified. The minimum order quantity is 10pc and the price is by case. The packaging details are customized plastic boxes. The delivery time is within 30 days and we accept T/T payment terms. Our supply ability is 1000pc/month. The SiC substrate size is 6Inch. Place of origin is China.



Sic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power Electronics


Our services:

ZMSH offers a comprehensive range of silicon carbide substrate 4H-P solutions, including high-precision cutting, professional polishing, customized doping, and rigorous quality testing to ensure that each substrate meets your specific needs for high-performance, highly reliable and long-life semiconductor devices.


FAQ:

1. Q: What is silicon carbide substrate 4H-P type?
A: Silicon Carbide substrate Type 4H-P is a silicon carbide material with a specific crystal structure, mainly used in the manufacture of high-performance power semiconductor devices.

2. Q: How to choose high quality 4H-P type silicon carbide substrate?
A: Key parameters such as crystal quality, impurity concentration, surface roughness and dimensional accuracy should be paid attention to, and suppliers with a good reputation and strict quality control should be selected.

3. Q: What are the key steps in the production process of 4H-P type silicon carbide substrate?
A: Including raw material synthesis, crystal growth, cutting, polishing and inspection steps, each step requires high precision and strict control to ensure the quality of the final product.

Tag: #4H-P type Sic, #Silicon carbide substrate, #Silicon carbide polishing.

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Sic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power Electronics

Ask Latest Price
Brand Name :
ZMSH
Model Number :
4H-P SiC
Certification :
rohs
Place of Origin :
CHINA
MOQ :
10pc
Price :
by case
Contact Supplier
Sic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power Electronics
Sic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power Electronics
Sic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power Electronics
Sic Silicon Carbide Wafer 5*5mm/10*10mm 4H-P Type Production Grade For Power Electronics

SHANGHAI FAMOUS TRADE CO.,LTD

Verified Supplier
8 Years
shanghai, shanghai
Since 2013
Business Type :
Manufacturer, Agent, Importer, Exporter, Trading Company
Total Annual :
1000000-1500000
Certification Level :
Verified Supplier
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