Semi-automatic room temperature bonding machine 2/4/6/8/12inch Compatible material Sapphire Si SiC InP GaAs GaN LT/LN Diamond Glass

Semi-Automatic Room Temperature Bonding Machine is a precision device for Wafer-Level or Chip-Level bonding. Mechanical pressure + surface activation technology enables permanent bonding between materials at room temperature (20-30 ° C) without high temperatures or additional adhesives. It is suitable for semiconductor packaging, MEMS manufacturing, 3D IC integration and other fields, especially for the bonding needs of heat-sensitive materials and micro and nano structures.

Characteristic of Semi-automatic room temperature bonding machine

(1) Bonding technology
- Normal temperature bonding: operating temperature 25±5℃, avoid thermal stress damage to sensitive devices (such as CMOS, flexible substrate).
- Surface activation treatment: Plasma or chemical activation is optional to improve the bond strength (>10MPa).
- Multi-material compatibility: Support direct bonding of silicon (Si), Glass (Glass), quartz, polymer (PI/PDMS) and other materials.


(2) Precision and control
- Alignment accuracy: ±0.5μm (visual alignment system + precision mechanical platform).
- Pressure control: 0-5000N adjustable, resolution ±1N, uniformity >95%.
- Real-time monitoring: Integrated force sensor + optical interferometer, real-time feedback bond quality.


(3) Automation function
- Semi-automatic operation: manual loading and unloading + automatic bonding process, supporting single chip or wafer level processing.
- Programmable formulation: Store multiple sets of process parameters (pressure, time, activation conditions).
- Safety protection: emergency braking + anti-collision design, in line with SEMI S2/S8 safety standards.


(4) Cleanliness and reliability
- Class 100 Clean environment: built-in HEPA filter, particle control <0.3μm.
- Low defect rate: bond interface cavity rate <0.1% (@200mm wafer).

Technical specifications

The semi-automatic room temperature bonding machine solves the limitation of traditional bonding technology on heat-sensitive materials through high precision and low temperature process, and has irreplaceable advantages in the fields of 3D IC, MEMS and optoelectronics. We are committed to providing customers with high reliability, low cost bonding solutions to facilitate the development of advanced packaging and micro and nano manufacturing technology.

Application of Semi-automatic room temperature bonding machine

(1) Semiconductor advanced packaging
· 3D IC integration: Through silicon (TSV) wafers are bonded at room temperature to avoid warping problems caused by high temperatures.
· Heterogeneous integration: Stacking bonding of logic chips and memory chips (such as HBM).


(2) MEMS device manufacturing
· Wafer-level packaging: vacuum sealing bonding of MEMS devices such as accelerometers and gyroscopes.
· Microfluidic chip: PDMS and glass bond at room temperature to maintain biological activity.


(3) Optoelectronics and display
· LED package: Sapphire substrate (Sapphire) and silicon substrate bonding without glue.
· AR/VR optical module: low temperature bonding of waveguide and glass lens.


(4) Scientific research and special applications
· Flexible electronics: lossless bonding of PI substrate to thin film sensor.
· Quantum devices: low-temperature compatible bonding of superconducting qubit chips.