Copper Heat Sink Substrate flat bottom pin type high power electronic device Cu≥99.9%

Copper Heat Sink Substrate is a heat dissipating element made of high thermal conductivity pure copper (Cu≥99.9%) or copper alloy (such as C1100, C1020) as the core material through precision machining (CNC cutting, stamping, welding, etc.). Mainly used for thermal management of high power electronic devices (such as LED, IGBT, CPU). According to the structure, it can be divided into Flat Base and Pin-Fin, which are designed for different heat dissipation requirements.

Flat bottom and needle type of copper cooling substrate

With its ultra-high thermal conductivity and customizable construction, copper cooling substrates are the core components for high power electronic cooling. The flat-bottom model is suitable for compact thermal conductivity needs, while the pin model is optimized for forced convection heat dissipation, and together they cover thermal management scenarios from consumer electronics to industrial scale.

Characteristic of copper heat sink substrate

(1) Thermal conductivity
· Thermal conductivity ≥380W/(m·K), much higher than aluminum (~200W/(m·K)), suitable for high heat density scenarios.

· The surface can be nickel-plated (Ni) or anti-oxidation treatment to prevent copper oxidation leading to thermal resistance rise.

(2) Mechanical properties
· Tensile strength 200-350MPa, can be processed into a thin 0.3mm soaking plate.

· High temperature resistance (long-term operating temperature ≤200℃), suitable for high-power devices.

(3) Structural design
· Flat bottom type: flat contact surface, suitable for direct fitting with the chip (such as LED COB package).

· Pin type: Dense Fin (Pin-fin) structure, which increases the heat transfer efficiency by increasing the surface area.

(4) Surface treatment
· Optional electroless nickel plating (ENIG), sandblasting or antioxidant coating to meet different environmental requirements.