Microjet laser equipment High energy pulsed laser chip microhole and TSV processing LASER MICROJET (LMJ)

Microjet laser equipment is a kind of precision machining system that combines high energy laser and micron-scale liquid jet, mainly used in high-end manufacturing fields such as semiconductor, optoelectronics and medical. The core principle is to achieve sub-micron machining accuracy (up to 0.5μm) and near zero heat affected zone (HAZ<1μm) by coupling pulsed laser light (such as ultraviolet or green light) to a high-speed liquid jet (usually deionized water or inert liquid), taking advantage of the liquid's guiding, cooling and debris removal functions. In the semiconductor industry, the technology is significantly better than traditional processes, such as: cutting silicon carbide (SiC) wafers under 5μm edge breakage control, speed up to 100mm/s; When machining 3D IC through-silicon hole (TSV), hole wall roughness Ra<0.5μm, depth to width ratio of 10:1; It can also be used for GaN device gate etching and RDL window opening in advanced packages with an accuracy of ±1μm. Its unique advantages include no mechanical stress, no chemical contamination, compatibility with clean room environments, and support for femtosecond laser upgrades for nanoscale processing.

Working principle of microjet laser technology

The focused laser beam is coupled into the high-speed water jet, and the energy beam with uniform distribution of cross section energy is formed after full reflection on the inner wall of the water column. It has the characteristics of low line width, high energy density, controllable direction and real-time reduction of surface temperature of processed materials, providing excellent conditions for integrated and efficient finishing of hard and brittle materials.
Laser micro-water jet machining technology takes advantage of the phenomenon of total reflection of laser at the interface of water and air, so that the laser is coupled inside the stable water jet, and the high energy density inside the water jet is used to achieve material removal.

Technical specifications

Technical application field

Semiconductor field

The silicon carbide ingot is round

The "gentle" machining approach of Microjet laser (LMJ) technology meets the increasing quality requirements for cutting, grooving, and cutting sensitive semiconductor materials, achieving smooth vertical cutting edges, maintaining high wafer fracture strength of the material, and significantly reducing the risk of breakage.

Features:
The thermal damage area is almost negligible.
The processing cost per hour is 55% of the traditional processing technology;
The yield exceeds 99%;
Manpower costs are one-tenth of what they are now;

Wafer slice
Features:
6-inch single wafer reduces total substrate cost by 35%; 8 times more efficient
FRT surface topography test BOW=1.4μm
AFM surface test Ra=0.73μm
CMP can be performed directly on the wafer surface

Note: Microjet laser can be used for substrate thickness ≥250μm custom slicing

Gallium oxide slicing/scribing

For brittle materials, the microjet laser is applied without mechanical stress or ultra-high energy, which can better solve the problem of material cracking during processing.

Gallium oxide cutting without edge collapse, no cracks, no gallium ion due to high temperature liquefaction adhesion.

LTCC ceramic substrate field

The advanced technology of microjet laser is irreplaceable in this field, which can accurately achieve the ultra-high index requirements of the taper, roundness, positioning and flatness of the probe holes, and avoid the processing defects of multi-layer heterogeneous materials.