Specifications
Brand Name :
PAM-XIAMEN
Place of Origin :
China
MOQ :
1-10,000pcs
Payment Terms :
T/T
Supply Ability :
10,000 wafers/month
Delivery Time :
5-50 working days
Packaging Details :
Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere
product name :
P Type InAs Indium Arsenide Wafer
Wafer Diamter :
2 inch
Conduction Type :
P Type
Grade :
Test Grade
Wafer Thickness :
500±25um
keyword :
InAs wafer
Description

P Type , Zn-doped Single Crystal InAs Wafer , 2”, Test Grade

PAM-XIAMEN offers InAs wafer – Indium Arsenide which are grown by LEC(Liquid Encapsulated Czochralski) or VGF(Vertical Gradient Freeze) as epi-ready or mechanical grade with n type, p type or undoped in different orientation(111),(100) or (110). PAM-XIAMEN can provide epi ready grade InAs wafer for your MOCVD & MBE epitaxial application .Please contact our engineer team for more wafer information.

2" InAs Wafer Specification

Item Specifications
Dopant Zinc
Conduction Type P-type
Wafer Diameter 2"
Wafer Orientation (100)±0.5°
Wafer Thickness 500±25um
Primary Flat Length 16±2mm
Secondary Flat Length 8±1mm
Carrier Concentration (1-10)x1017cm-3
Mobility 100-400cm2/V.s
EPD <3x104cm-2
TTV <10um
BOW <10um
WARP <12um
Laser marking upon request
Suface finish P/E, P/P
Epi ready yes
Package Single wafer container or cassette

What is the InAs Process?

InAs wafers must be prepared prior to device fabrication. To start, they must be completely cleaned to remove any damage that might have occurred during the slicing process. The wafers are then Chemically Mechanically Polished/Plaranrized (CMP) for the final material removal stage. This allows for the attainment of super-flat mirror-like surfaces with a remaining roughness on an atomic scale. After that is completed, the wafer is ready for fabrication.

Band structure and carrier concentration of InAs Wafer

Basic Parameters

Energy gap 0.354 eV
Energy separation (EΓL) between Γ and L valleys 0.73 eV
Energy separation (EΓX) between Γ and X valleys 1.02 eV
Energy spin-orbital splitting 0.41 eV
Intrinsic carrier concentration 1·1015 cm-3
Intrinsic resistivity 0.16 Ω·cm
Effective conduction band density of states 8.7·1016 cm-3
Effective valence band density of states 6.6·1018 cm-3

P Type , Zn-doped Single Crystal InAs Wafer , 2”, Test Grade Band structure and carrier concentration of InAs.
Important minima of the conduction band and maxima of the valence band.
Eg= 0.35 eV
EL= 1.08 eV
EX= 1.37 eV
Eso = 0.41 eV

Temperature Dependences

Temperature dependence of the direct energy gap

Eg = 0.415 - 2.76·10-4·T2/(T+83) (eV),

where T is temperature in degrees K (0 <T < 300).

Effective density of states in the conduction band

Nc≈1.68·1013·T3/2 (cm-3).

Effective density of states in the valence band

Nv≈ 1.27·1015·T3/2(cm-3).

P Type , Zn-doped Single Crystal InAs Wafer , 2”, Test Grade The temperature dependences of the intrinsic carrier concentration.
P Type , Zn-doped Single Crystal InAs Wafer , 2”, Test Grade Fermi level versus temperature for different concentrations of shallow donors and acceptors.

Dependences on Hydrostatic Pressure

Eg≈Eg(0) + 4.8·10-3P (eV)
EL≈ EL(0) + 3.2·10-3P (eV)

where P is pressure in kbar

Energy Gap Narrowing at High Doping Levels

P Type , Zn-doped Single Crystal InAs Wafer , 2”, Test Grade Energy gap narrowing versus donor (Curve 1) and acceptor (Curve 2 ) doping density.
Curves are calculated according
Points show experimental results for n-InAs

For n-type InAs

ΔEg = 14.0·10-9·Nd1/3 + 1.97·10-7·Nd1/4 + 57.9·10-12·Nd1/2 (eV)

For p-type InAs

ΔEg = 8.34·10-9·Na1/3 + 2.91·10-7·Na1/4 + 4.53·10-12·Na1/2 (eV)

Effective Masses

Electrons:

P Type , Zn-doped Single Crystal InAs Wafer , 2”, Test Grade Electron effective mass versus electron concentration

For Γ-valley mΓ = 0.023mo
Nonparabolicity:
E(1+αE) = h2k2/(2mΓ)
α = 1.4 (eV-1)
In the L-valley effective mass of density of states mL=0.29mo
In the X-valley effective mass of density of states mX=0.64mo

Holes:

Heavy mh = 0.41mo
Light mlp = 0.026mo
Split-off band mso = 0.16mo

Effective mass of density of states mv = 0.41mo

Donors and Acceptors

Ionization energies of shallow donors

≥ 0.001(eV): Se, S, Te, Ge, Si, Sn, Cu

Ionization energies of shallow acceptors, eV

Sn Ge Si Cd Zn
0.01 0.014 0.02 0.015 0.01

Are You Looking for an InAs Wafer?

PAM-XIAMEN is your go-to place for everything wafers, including InAs wafers, as we have been doing it for almost 30 years! Enquire us today to learn more about the wafers that we offer and how we can help you with your next project. Our group team is looking forward to providing both quality products and excellent service for you!

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P Type , Zn-doped Single Crystal InAs Wafer , 2”, Test Grade

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Brand Name :
PAM-XIAMEN
Place of Origin :
China
MOQ :
1-10,000pcs
Payment Terms :
T/T
Supply Ability :
10,000 wafers/month
Delivery Time :
5-50 working days
Contact Supplier
P Type , Zn-doped Single Crystal InAs Wafer , 2”, Test Grade

XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

Active Member
6 Years
fujian, xiamen
Since 1990
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Total Annual :
10 Million-50 Million
Employee Number :
50~100
Certification Level :
Active Member
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