3”Size 4H Semi-Insulating SiC Epi Ready Wafer in Research Grade for Graphene Epitaxial Growth
PAM-XIAMEN provides high quality single crystal SiC (Silicon Carbide)wafer for electronic and optoelectronic industry. SiC wafer is a next generation semiconductor materialwith unique electrical properties and excellent thermal properties for high temperature and high power device application. SiC wafer can be supplied in diameter 2~6 inch, both 4H and 6H SiC , N-type , Nitrogen doped , and semi-insulating type available.
Epitaxial growth of graphene on silicon carbide (SiC)
I. To fabricate and test electronic devices made from graphene on silicon carbide (SiC) substrates, it needs high-quality graphene to be processed. And to get qualified graphene, it needs qualified SiC substrate.
II. If the required wafers will be used to fabricate high-quality epitaxial graphene by annealing small sections of the wafer in Argon gas background, the quality of the wafers is critical, as are the surface finish (chemical-mechanical epitaxial grade polish) and miscut relative to the basal crystal plane of 4H-SiC(0001).
III. 100 mm diameter SiC substrates with the following technical requirements:
2. 100% Semi-insulating SiC wafers of 100 mm diameter with minimum crystal defects
3. 100% high-purity on-axis type single-crystal 4H-SiC(0001) with no intentional doping.
4. Surface oriented parallel to the (0001) crystal plane to within 0.10 degree.
5. SiC(0001) surface is Epi-Ready polished substrate on which graphene can be grown.
6. Wafer bow is less than 25 micrometers for each wafer.
Please contact us for more information:
SILICON CARBIDE MATERIAL PROPERTIES
Polytype | Single Crystal 4H | Single Crystal 6H |
Lattice Parameters | a=3.076 Å | a=3.073 Å |
c=10.053 Å | c=15.117 Å | |
Stacking Sequence | ABCB | ABCACB |
Band-gap | 3.26 eV | 3.03 eV |
Density | 3.21 · 103 kg/m3 | 3.21 · 103 kg/m3 |
Therm. Expansion Coefficient | 4-5×10-6/K | 4-5×10-6/K |
Refraction Index | no = 2.719 | no = 2.707 |
ne = 2.777 | ne = 2.755 | |
Dielectric Constant | 9.6 | 9.66 |
Thermal Conductivity | 490 W/mK | 490 W/mK |
Break-Down Electrical Field | 2-4 · 108 V/m | 2-4 · 108 V/m |
Saturation Drift Velocity | 2.0 · 105 m/s | 2.0 · 105 m/s |
Electron Mobility | 800 cm2/V·S | 400 cm2/V·S |
hole Mobility | 115 cm2/V·S | 90 cm2/V·S |
Mohs Hardness | ~9 | ~9 |
4H Semi-Insulating SiC Wafer, Research Grade,3”Size
SUBSTRATE PROPERTY | S4H-51-SI-PWAM-250 S4H-51-SI-PWAM-330 S4H-51-SI-PWAM-430 |
Description | Research Grade 4H SEMI Substrate |
Polytype | 4H |
Diameter | (50.8 ± 0.38) mm |
Thickness | (250 ± 25) μm (330 ± 25) μm (430 ± 25) μm |
Resistivity (RT) | >1E5 Ω·cm |
Surface Roughness | < 0.5 nm (Si-face CMP Epi-ready); <1 nm (C- face Optical polish) |
FWHM | <50 arcsec |
Micropipe Density | A+≤1cm-2 A≤10cm-2 B≤30cm-2 C≤50cm-2 D≤100cm-2 |
Surface Orientation | |
On axis <0001>± 0.5° | |
Off axis 3.5° toward <11-20>± 0.5° | |
Primary flat orientation | Parallel {1-100} ± 5° |
Primary flat length | 16.00 ± 1.70 mm |
Secondary flat orientation Si-face:90° cw. from orientation flat ± 5° | |
C-face:90° ccw. from orientation flat ± 5° | |
Secondary flat length | 8.00 ± 1.70 mm |
Surface Finish | Single or double face polished |
Packaging | Single wafer box or multi wafer box |
Usable area | ≥ 90 % |
Edge exclusion | 1 mm |